Industrial rubber sheets (nbr, epdm, cr, sbr, gum, etc) , polyurethane products (sheets, rods, rollers, etc).
Synthetic rubber.
Raw rubber.
Unipoly Rubber & Plastics is an ISO 9001 certified provider of rubber and plastic molded products for a wide range of markets and industrial applications. We proudly maintain a clean, modern manufacturing facility with the latest most technologically advanced rubber and plastic molding machinery available. Our three rubbers and plastic molding competencies include: Compression Molding, Transfer Molding and Injection Molding. Unipoly Rubber & Plastics has almost 30 years experiences specializing in the manufacturing of high quality molded rubber and plastic products; including seals, gaskets, O-rings, hoses and custom products in various rubber, plastic and elastomer compounds. Our Company's reputation for distinction and quality has been built on our ability to provide our valued customers with the most effective designing, engineering and manufacturing solutions. Unipoly Rubber & Plastics is committed to consistently providing custom precision molded rubber and plastic products to meet all of your blueprint and tolerance specifications
Rubber transmission belt, conveyor belt, rubber sheet, rubber marine products, seismic isolation system for protecting human and physical assets from earthquake, rubber construction products, rubber chemical, synthetic rubber, pipe and fittings for ship building.
ITEM DESCRIPTION Substrate Size 156mm² solar wafer, 4pcs Deposition Direction Downward Plasma Source RF & VHF Power Supply Process Gas Any of Requested Gas (Solar : Si3N4,SiO2,Al2O3) Process Temperature ~ 700 C Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System
ITEM DESCRIPTION Substrate Size ~ 6inch Deposition Direction Downward Process Gas Any of Requested Gas Process Temperature ~ 1000 C on Substrate Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System
ITEM DESCRIPTION Substrate Size ~ 6inch Process Gas SiH4,GeH4,B2H6,PH3,Si2H6,H2,Ar Process Temperature ~ 800 C Halogen Lamp, Heating Load Lock, System Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 8inch Deposition Direction Upward Thermal Source ~ 10V, 300A Thickness Uniformity ± 3% Heating Uniformity ± 3% Full Automation Control.
ITEM DESCRIPTION Substrate Size ~ 8inch Heating Source Halogen Lamp Deposition Direction Up or Downward Process Temp ~ 1000 C Heating Uniformity ±3% Toggle Switch Control or Touch Panel Control.
ITEM DESCRIPTION Gun Size 2~16inch (Magnetron Sputter Gun) Substrate Size ~ 200mm (option) Process Gas Ar,O2,N2 Deposition Direction Up or Downward Process Temp ~ 700 C Thickness Uniformity
ITEM DESCRIPTION Substrate Size 156mm² solar wafer, 12pcs(3.5G case, Option) Sputtering Source based 1set (Option), Aprox 100 x 800m² 8T Process Gas Ar,O2,N2 Deposition Direction Up or Downward Al Film Thickness 2m Uniformity WIW,WTW,RTR ±5%.
ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Deposition Direction Downward Plasma Source RF & VHF Power Supply Process Gas Any of Requested Gas based on Ar,O2 Process Temperature ~ 700 C Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System.
ITEM DESCRIPTION Substrate Size ~ 6inch Deposition Direction Downward Process Gas Any of Requested Gas Process Temperature ~ 700 C on Substrate Source Heat Bubbler for Mo Source Thickness Uniformity ±5% Heating Uniformity ±3% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 12.5 inch Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 8inch Deposition Direction Upward E-BEAM Source ~ 15kw Thickness Uniformity ± 3% Heating Uniformity ± 3% Full Automation Control
ITEM DESCRIPTION Consisting of Evaporation,Sputter,Parylene,Glove Box,Loadlock Tact time 20~80 min Depends on the number of mask Loading Capacity Glass 1 Sheet, Mask 4 Sheet Transfer Methode Vacuum Robot Plasma Treatment Optional Evaporation Source for Organic (5ea) 10cc for host, 4cc for dopant Evaporation Source for metal (2ea) Thermal Source, E-Beam is optional Deposition Uniformity Organic, Metal, Sputter less than ±3% Max. deposition rate Organic 5A/sec, metal 10A/sec Rate Accuracy Organic ±5%, Metal ±7% Thickness reliability Organic & Metal ±5% glass to glass Conductive Oxide Low Damage Sputtering (FTS or General Sputter) Doping ratio less than 1% at 1A/sec of host.
ITEM DESCRIPTION Substrate Size 125mm² 16pcs, 156mm² 9pcs Heating Source Halogen Lamp Deposition Direction Up or Downward Process Temp ~ 1100 C Heating Uniformity ±5% Sustain Time More Than 2min. at 1100 Lamping Rate 10 to 20 C / sec Cooling Rate 5 to 20 C / sec Gas mixing capability with MFC .
