ITEM DESCRIPTION
Substrate Size ~ 200mm (Option)
Etching Direction Downward
Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6
Etching Uniformity ±5%
Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 12.5 inch Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
