Thermal Evaporator

The small plasma sputtering and evaporation two-in-one coating machine is equipped with DC sputtering target and thermal evaporation assembly, which can not only be used for metal film plating by plasma sputtering, but also obtain carbon or other metal elemental films by evaporation. The instrument components are highly integrated, which realize two kinds of coating functions in the same chamber. This coating machine adopts high purity quartz chamber as vacuum chamber, and the coating process is completely visible. The instrument is equipped with two stage rotary vane vacuum pump, which can quickly reach the vacuum degree of 1.0E-1pa, and can meet the vacuum environment required by most evaporation coating experiments and diode sputtering experiments. This instrument has small size which can save space and can be used on the test bench. One machine has multiple purposes, which is cost-effective and very suitable for major universities and research institutions to choose. Small two-in-one coating machine applications: Scanning electron microscope sample surface gold spraying, gold steaming carbon spraying and other operations, as well as the production of non-conductor material test electrode.

ITEM DESCRIPTION Substrate Size 156mm² solar wafer, 4pcs Deposition Direction Downward Plasma Source RF & VHF Power Supply Process Gas Any of Requested Gas (Solar : Si3N4,SiO2,Al2O3) Process Temperature ~ 700 C Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System

ITEM DESCRIPTION Substrate Size ~ 6inch Deposition Direction Downward Process Gas Any of Requested Gas Process Temperature ~ 1000 C on Substrate Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System

ITEM DESCRIPTION Substrate Size ~ 6inch Process Gas SiH4,GeH4,B2H6,PH3,Si2H6,H2,Ar Process Temperature ~ 800 C Halogen Lamp, Heating Load Lock, System Full Automation Control

ITEM DESCRIPTION Substrate Size ~ 8inch Heating Source Halogen Lamp Deposition Direction Up or Downward Process Temp ~ 1000 C Heating Uniformity ±3% Toggle Switch Control or Touch Panel Control.

ITEM DESCRIPTION Gun Size 2~16inch (Magnetron Sputter Gun) Substrate Size ~ 200mm (option) Process Gas Ar,O2,N2 Deposition Direction Up or Downward Process Temp ~ 700 C Thickness Uniformity

ITEM DESCRIPTION Substrate Size 156mm² solar wafer, 12pcs(3.5G case, Option) Sputtering Source based 1set (Option), Aprox 100 x 800m² 8T Process Gas Ar,O2,N2 Deposition Direction Up or Downward Al Film Thickness 2m Uniformity WIW,WTW,RTR ±5%.

ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Deposition Direction Downward Plasma Source RF & VHF Power Supply Process Gas Any of Requested Gas based on Ar,O2 Process Temperature ~ 700 C Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System.

ITEM DESCRIPTION Substrate Size ~ 6inch Deposition Direction Downward Process Gas Any of Requested Gas Process Temperature ~ 700 C on Substrate Source Heat Bubbler for Mo Source Thickness Uniformity ±5% Heating Uniformity ±3% Load Lock System, Full Automation Control