LE series thermal grease has good thermal conductive performance and reliability and can wet the surface of copper and aluminum which is extremely suit for the heat transfer of the CPU, GPU and other heating power components. As LE series has low adhesion, can fully wet the surface, form very low surface thermal resistance, it can quickly transfer the heat to cooling device. Just paste the grease on the gap between the power components and cooling device to help dismiss the air gap and enlarge the heat flow, decrease thermal resistance, reduce the temperature of power components, improve reliability and extend the usage life
Typical Applications:
Between Semiconductor and heatsink
Between CPU and heatsink
Between power resistor and base
Thermoelectric cooler
The surface of temperature regulator and assembly
High-power LED lighting
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Used on screw insulation sleeve;
Locked on transistor to avoid short circuit between the cooling fins of the crystal shell.
LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders. With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 Long-term use. As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proof, anti-seismic, anti-corona, anti-leakage and aging .The properties are widely used for the adhesion and sealing of the electronic components with high thermal conductivity, which is a single part of the acetone oxime type, It can be cured silicone rubber and conforms to the requirements of ROHS REACH UL.
Typical Applications
High power LED lamps and lanterns, electrical power, microwave oven, electronic components and other industrial products of thermal conductive adhesive sealing, alternative thermal conductive silicone used in high-power electric module and radiator thermal conductivity between fixed filling adhesive, no card buckle screw, more reliable filling heat, simple process and lower cost.
Applying Process
1.Surface clean : Clean the surface of the adhesive object and remove the rust, dust and oil.
2.Sizing: Twist the cap of the hose, squeeze the gel into the clean surface, and make it natural.
3.Curing: Place the bonded or sealed parts in the air while them to solidify naturally. Curing is a process from surface to the internal, within 24 hours (at room temperature and 55% relative humidity) will cure the depth of the 2 ~ 4 mm, if the site location is deeper that completely curing time will be postpone, especially it is not easy to come into contact with air. if the temperature is low, cure time also will be postpone .Prior to further processing or wrapping the bonded parts, it is recommended that the user wait long enough to ensure that the adhesion and integrity of the adhesion are not affected.
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LGS300 graphite thermal pad is a new thermal interface material. It transfers heat along the two directions, shielding heat source and components meanwhile improving the performance of consumer electronics products. The thermal impedance of LGS is very small and can completely replace the high-performance thermal grease while avoiding the shortcoming of poor and dirty thermal grease process. LGS thermal conductivity is three-dimensional, that is not only it can transfer heat between the heat source and the radiator in the vertical direction, but also in the vertical direction, which ensures that it can quickly transfer heat out in vertical direction when the partial heat is high. Therefore, LGS thermal film is very suitable in the small space to efficiently transfer heat generated by heat source.
Features & Benefits:
Ultra-high thermal conductivity, easy to operate;
Low thermal resistance
Light weight
Typical Applications:
IC ; CPU; MOS; LED; Heat sink; LCD-TV; Laptop; Communication equipment; Wireless switch; DVD; Hand-held device; Camera/digital camera; Mobile phone
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LGS1500 is a synthetic graphite heat sink.LGS1500 has an unique grain orientation, lamellar structure can be well adapted to any surface, even heat conduction along the two directions. Plane thermal conductivity of up to 1900W/m-K. LGS1500 products while also the thickness of uniform heat to provide thermal isolation. Heat shielding and components while improving the performance of consumer electronics products. LGS1500 composite graphite sheet is a polyimide sintered novel film material with high thermal conductivity and excellent product design flexibility.
Features & Benefits:
1.High thermal conductivity -flat heat conductivity can be up to1900W /m-K,40% lower thermal resistance than aluminum, 20% lower than copper
2.Ultra-light -than the same size aluminum to 30%lighter, 80%lighter than copper
3.Thin -thickness from 0.017 ï¼?0.025mm and 0.04mm
4.Temperature resistance-using temperature up to 400, the minimum can be lower than-40
5.Easy processing-can be made into different die sizes, shapes and thickness, can provide planar sheet die
6.Ease of use-graphite heat sink can be applied to any smooth flat and curved surfaces
7.Flexibility- easily with the metal, the insulating layer or double-sided adhesive made of plywood, increase design flexibility in the back with adhesive
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LGS1500 is a synthetic graphite heat sink.LGS1500 has an unique grain orientation, lamellar structure can be well adapted to any surface, even heat conduction along the two directions. Plane thermal conductivity of up to 1900W/m-K. LGS1500 products while also the thickness of uniform heat to provide thermal isolation. Heat shielding and components while improving the performance of consumer electronics products. LGS1500 composite graphite sheet is a polyimide sintered novel film material with high thermal conductivity and excellent product design flexibility.
Features & Benefits:
1.High thermal conductivity -flat heat conductivity can be up to1900W /m-K,40% lower thermal resistance than aluminum, 20% lower than copper
2.Ultra-light -than the same size aluminum to 30%lighter, 80%lighter than copper
3.Thin -thickness from 0.017 �?0.025mm and 0.04mm
4.Temperature resistance-using temperature up to 400, the minimum can be lower than-40
5.Easy processing-can be made into different die sizes, shapes and thickness, can provide planar sheet die
6.Ease of use-graphite heat sink can be applied to any smooth flat and curved surfaces
7.Flexibility- easily with the metal, the insulating layer or double-sided adhesive made of plywood, increase design flexibility in the back with adhesive
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LP900 is a silicon carbide ceramic heat sink and it belongs to the micro-hole structure. Under the same unit area,it can be more than 30% porosity, greatly increasing the heat transfer area with air to enhance its cooling effect. At the same time its heat capacity is small, its heat storage is small and the heat can be more quickly to the outside world. Ceramic heat sink main features: environmental protection, insulation resistance to high pressure, efficient heat, to avoid brewing EMI problems. So it can effectively solve the electronic and home appliance industry thermal and cooling problems, while it is specially for small and medium wattage power consumption, design space pay attention to light, thin, short, small products. Whats more, it can provide technical support and application for electronic products innovative and development.
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Polycarbonate PC-insulation mylar is the plastic material by calendaring molding technology, with excellent flame rating V0, halogen-free environment protection, aging resistance, good mechanical properties and electrical insulation performance.
Black color, matte side of the light / matte.
Standard thickness: 0.1,0.15,0.25,0.43,0.5 MM
Features & Benefits:
Insulation resistance.
No bromine chloride.
Flame Rating V-0.
Excellent mechanical properties and temperature resistance, stable size
Typical Applications:
Electrical insulation for power products.
TV insulation.
Insulated from the enclosure to PCB
Insulation of inductance, resistance, capacitance and other parts.
High voltage requirement occasion
For more , please kindly feel free to
LCE series gel is a thermal conductive material with extremely low deformation rate. Its plasticity like plasticine, no flow, high thermal conductivity, low thermal resistance, good adhesion to heat-dissipating components, insulation, automatically fill the gap, maximum increase of limited contact area, and the infinite compression feature is suitable for heat dissipation modules or electronic components with large thickness variation. Unlike thermal grease, the thermal gel wont settlement and flow. It is suitable for screen printing or blade coating. The syringe package can be dispensed on standard dispensing equipment, which has high operation convenience and efficiency.
Features & Benefits:
High thermal conductivity, low thermal resistance, excellent wettability;
Soft, unstressed, with infinite compression of the thinnest 0.1mm;
No settlement, no flow, can fill any uneven gap;
The design is convenient and can be used to adjust the size of any thickness.
Typical Applications:
Communication equipment
Radio equipment
Automotive electronics
Case or related cooling module
Mainframe and small office networking equipment
For more , please kindly feel free to contact
LT240 Alumina oxide ceramic plate has a high thermal conductivity : 24w/m.k, it is of simple construction and small volume, but it can resist acid and alkali corrosion, work in high temperature and pressure and of stable performance for a long time.0.635mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm can be offered for TO-220, TO-247, TO-264, TO-3P sizes, customized size is available, ROHS is compliant.
Typical applications
IC, MOS, transistor, schottky, IGBT, high density switch power supply, HF communications equipment and brazing machine.
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LT1800 Aluminum nitride conductive ceramic sheet has high thermal conductivity 180W/m-k,one of the highest thermal conductivity materials in metallic materials (7~10 times of alumina ceramic sheet). Excellent mechanical properties, good processing, high precision, smooth surface, no microcracks, bending, etc. Low dielectric constant and dielectric loss, reliable electrical insulation performance. Non-toxic, high temperature of 1800 degrees, oil resistant, chemical resistant, and similar to the thermal expansion coefficient of silicon, without hygroscopic property, stable performance and high reliability in high temperature and high humidity. Along with the microelectronic devices,
Features & Benefits:
Extremely high thermal conductivity
High temperature and high humidity
Good insulation Good chemical stability
Typical Applications:
Application of optical communication devices
High frequency microwave application
Power electronic components
LED industry Car electronic module
The thermal module substrate
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LT240 Alumina oxide ceramic plate has a high thermal conductivity : 24w/m.k, it is of simple construction and small volume, but it can resist acid and alkali corrosion, work in high temperature and pressure and of stable performance for a long time.0.635mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm can be offered for TO-220, TO-247, TO-264, TO-3P sizes, customized size is available, ROHS is compliant.
Typical applications
IC, MOS, transistor, schottky, IGBT, high density switch power supply, HF communications equipment and brazing machine.
For more , please kindly feel free to contact
LP900 is a silicon carbide ceramic heat sink and it belongs to the micro-hole structure. Under the same unit area,it can be more than 30% porosity, greatly increasing the heat transfer area with air to enhance its cooling effect. At the same time its heat capacity is small, its heat storage is small and the heat can be more quickly to the outside world. Ceramic heat sink main features: environmental protection, insulation resistance to high pressure, efficient heat, to avoid brewing EMI problems. So it can effectively solve the electronic and home appliance industry thermal and cooling problems, while it is specially for small and medium wattage power consumption, design space pay attention to light, thin, short, small products. Whats more, it can provide technical support and application for electronic products innovative and development.
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LT1800 Aluminum nitride conductive ceramic sheet has high thermal conductivity 180W/m-k,one of the highest thermal conductivity materials in metallic materials (7~10 times of alumina ceramic sheet). Excellent mechanical properties, good processing, high precision, smooth surface, no microcracks, bending, etc. Low dielectric constant and dielectric loss, reliable electrical insulation performance. Non-toxic, high temperature of 1800 degrees, oil resistant, chemical resistant, and similar to the thermal expansion coefficient of silicon, without hygroscopic property, stable performance and high reliability in high temperature and high humidity. Along with the microelectronic devices,
Features & Benefits:
Extremely high thermal conductivity
High temperature and high humidity
Good insulation Good chemical stability
Typical Applications:
Application of optical communication devices
High frequency microwave application
Power electronic components
LED industry Car electronic module
The thermal module substrate
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LC120 thermal silicone pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
Features & Benefits:
Low cost, high efficiency, cost-effective
Replace the volatile pollution of the thermal grease
Natural sticky, easy to install, can be reused
Wide range of thickness, can fill any uneven size gap
Electrical insulation
Typical Applications:
Communication equipment
New energy vehicles / power batteries
Computer
Car equipment / charger
Switching power supply
PC server / workstation
Flat-panel TV
Optical drive / COMBO
Security equipment
Notebook computers
Video equipment
Any heating element and radiator
For more , please kindly feel free to contact
Ultra-high thermal conductive silicone sheet is a high-performance heat conducting interface material made of 100% imported materials for fillingthe air gaps between the heating device and the heat sink or metal base.Its softness and elasticity characteristics enable it to be used for coveringa very uneven surface. Heat is transferred from the separation device or the entire PCB to the metal casing or diffuser to improve heat dissipationand improve the efficiency of heating electronic components and service
Features & Benefits:
High thermal conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect sensitive electronic devices
Natural sticky, easy assembly, re-workable
Meet ROHS and UL environmental requirements
Typical Applications:
CPU, memory module
Communication hardware equipment
High-speed hard disk drive
Automotive engine control module
Microprocessors, memory chips and graphics processors
Military electronic equipment
For more , please kindly feel free to contact
High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.
Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive
For more , please kindly feel free to contact
LC120 thermal silicone pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
Features & Benefits:
Low cost, high efficiency, cost-effective
Replace the volatile pollution of the thermal grease
Natural sticky, easy to install, can be reused
Wide range of thickness, can fill any uneven size gap
Electrical insulation
Typical Applications:
Communication equipment
New energy vehicles / power batteries
Computer
Car equipment / charger
Switching power supply
PC server / workstation
Flat-panel TV
Optical drive / COMBO
Security equipment
Notebook computers
Video equipment
Any heating element and radiator
Physical Properties:
Test Item Test Method Unit LC120
Color Visual - Off white
Thickness ASTM D374 mm 0.3~15.0
Hardness ASTM D2240 Shore 00 40±5~80±5
Specific Gravity ASTM D792 g/cm3 2.1
Tensile Strength ASTM D412 Mpa 0.34
Elongation ASTM D412 % 100
Tear Strength GBT 529-2008 KN/m 1.4
Breakdown Voltage ASTM D149 KV/mm â?¥10
Volume Resistivity ASTM D257 Ω·cm 8Ã?1012
Continuous Use Temp EN344 -40~150
Flame Rating UL 94 - V-0
Weight Loss @150240H % â?¤0.5%
Dielectric Constant ASTM D150 @1MHz 5.41
Thermal Conductivity ASTM D5470 W/m·K 1.2
Standard sizeï¼?200mmÃ?400mmï¼?300mmÃ?400mmï¼?Customized size available;
Coated with fiberglass/one side or double side adhesive/aluminum foil available
LCG is a kind of thermal interface material which coating thermal conductive polymer on a layer of fiberglass. The stickiness of the material is slightly weakness for easy procession. And insulation and tear resistance are also better. Its stickiness and flexibility, even in extremely rough and very uneven surface, also can bring a good thermal filling effect.
Features & Benefits:
Fiberglass substrate, anti-puncture, shear and tear resistance
Only the bottom with a sticky, slightly faint on the front, easy to install
High-load, low-hardness gap filling material
Strong electrical insulation
Typical Applications:
AC / DC power supply
Car equipment / charger
Between the motherboard and the chassis
Drive control any heating element
Uninterruptible power supply (UPS)
Power semiconductor-TO packaging products
LCD thermal conductive silicon mud is short for thermal conductive mud and have good thermal conductivity and insulation. The shape likes plasticine, no flow, not be dried solid, no volatile, high and low temperature endurance, take it without adhere your hands ,high viscosity, use repeatedly, can be molded into a certain shape, easy to use. Filling between the electronic component to be cooled and the heat sink / case, contacting closely to reduce the thermal resistance, quickly and efficiently reducing the temperature of electronic components to extend the electronic component the life and improve its reliability. Because of its good filling and low price, they are widely used in LED lighting industry and also the best choice for thermal cooling of the lighting industry when selecting thermal conductive materials.
Features & Benefits:
High reliability, excellent chemical and mechanical stability
Easy to meet the requirements for thickness variation in product design
After forming is not deformed in a static use, no settlement
Thermal insulation, excellent resistance to aging
Meet the environmental requirements of ROHS and UL
Rubber sludge, plasticity, repeated use
Typical Applications:
LED 1.Integrated LED internal drive
2. Round cap screw-type LED lamp
Solar
Backlight module
LCD-TV/PDP
For more , please kindly feel free to contact rita(at)szutd.com
The LCV series silicon cloth is a kind of cloth production which made based on fiberglass substrate through special processing. Because of its nice thermal conductivity, insulation and convenient assembly, it widely used in electronic appliances industry. When using, you should select different thickness of the thermal conductive silicon tape to cut according to the size of the fever interface and the height of the gap. Then putting the silicon tape in the gap between the fever interface and their components gap to play as a heat-conducting medium.
Features & Benefits:
Heat resistance, insulation, fire prevention, shock resistance
Typical Applications:
Heating power components
Automobile electronic heating module
Power module
Household appliances
Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate.
The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sinks performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module. The phase change characteristics: the material is solid in room temperature and installation is completely convenient, used between heatsink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material cannot
Features & Benefits:
Low heat resistance and low stress
Natural sticky, easy to use-no need to use glue
No radiator preheating
Flow but not silicon oil
Low volatility--less than 1%
High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.
Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive
For more , please kindly feel free to contact rita(at)szutd.com
LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders. With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 Long-term use. As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proof, anti-seismic, anti-corona, anti-leakage and aging .The properties are widely used for the adhesion and sealing of the electronic components with high thermal conductivity, which is a single part of the acetone oxime type, It can be cured silicone rubber and conforms to the requirements of ROHS REACH UL.
Typical Applications
High power LED lamps and lanterns, electrical power, microwave oven, electronic components and other industrial products of thermal conductive adhesive sealing, alternative thermal conductive silicone used in high-power electric module and radiator thermal conductivity between fixed filling adhesive, no card buckle screw, more reliable filling heat, simple process and lower cost.
Applying Process
1.Surface clean : Clean the surface of the adhesive object and remove the rust, dust and oil.
2.Sizing: Twist the cap of the hose, squeeze the gel into the clean surface, and make it natural.
3.Curing: Place the bonded or sealed parts in the air while them to solidify naturally. Curing is a process from surface to the internal, within 24 hours (at room temperature and 55% relative humidity) will cure the depth of the 2 ~ 4 mm, if the site location is deeper that completely curing time will be postpone, especially it is not easy to come into contact with air. if the temperature is low, cure time also will be postpone .Prior to further processing or wrapping the bonded parts, it is recommended that the user wait long enough to ensure that the adhesion and integrity of the adhesion are not affected.
For more , please kindly feel free to contact rita(at)szutd.com
Ultra-high thermal conductive silicone sheet is a high-performance heat conducting interface material made of 100% imported materials for fillingthe air gaps between the heating device and the heat sink or metal base.Its softness and elasticity characteristics enable it to be used for coveringa very uneven surface. Heat is transferred from the separation device or the entire PCB to the metal casing or diffuser to improve heat dissipationand improve the efficiency of heating electronic components and service
Features & Benefits:
High thermal conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect sensitive electronic devices
Natural sticky, easy assembly, re-workable
Meet ROHS and UL environmental requirements
Typical Applications:
CPU, memory module
Communication hardware equipment
High-speed hard disk drive
Automotive engine control module
Microprocessors, memory chips and graphics processors
Military electronic equipment
For more , please kindly feel free to contact rita(at)szutd.com
LCN is a kind of thermal conductive pad which do not contain silicone oil and do not volatilize and apply in optical instrument and those have sensitivity on silicone oil. There is silicone oil exuding from traditional thermal pad after heating, however, LCN absolutely solve this problem of silicone oil leakage. Whats more, the LCN series are especially fitting for filling no flat and high cumulative tolerance interface.
Features & Benefits:
No siloxane, no volatilization, no pollution
Soft and low hardness material, good for filling
High thermal conductive, low contact heat resistance
Electric insulator
Typical Applications:
The products you are afraid of being polluted by silicone oil
Optical precision equipment
Laptop and projector
Mobile and communication equipment, high speed large storage driver
Heat pipe assembly, control equipment of car engine Telecommunication hardware and equipment
High-end industrial control, and medical electronic area
LCK-10 silicon pad is a high-performance insulating material substrate of Kapton membrane coating with silicone and has good thermal conductivity and anti-pierce.LCK-10 is designed For those ceramic insulator substitutes like beryllium oxide�??boron nitride and bauxite. As we know that ceramic insulators very expensive and easy broken,however,LCK-10 is hard To broke and the price of it is low.
Features & Benefits:
Heat emission, insulation , fire prevention, shock resistance.
Thermal impedance: 0.41-in2/w(50psi)
Breakdown voltage can reach at 7000V
Designed for the substitutes of the ceramic insulators
Typical Applications:
Heating power components; Automobile electronic heating module; Power module; Household appliances;
LCK-10 silicon pad is a high-performance insulating material substrate of Kapton membrane coating with silicone and has good thermal conductivity and anti-pierce.LCK-10 is designed For those ceramic insulator substitutes like beryllium oxideã??boron nitride and bauxite. As we know that ceramic insulators very expensive and easy broken,however,LCK-10 is hard To broke and the price of it is low.
Features & Benefits:
Heat emission, insulation , fire prevention, shock resistance.
Thermal impedance: 0.41-in2/w(50psi)
Breakdown voltage can reach at 7000V
Designed for the substitutes of the ceramic insulators
Typical Applications:
Heating power components; Automobile electronic heating module; Power module; Household appliances;
LCE series gel is a thermal conductive material with extremely low deformation rate. Its plasticity like plasticine, no flow, high thermal conductivity, low thermal resistance, good adhesion to heat-dissipating components, insulation, automatically fill the gap, maximum increase of limited contact area, and the infinite compression feature is suitable for heat dissipation modules or electronic components with large thickness variation. Unlike thermal grease, the thermal gel wont settlement and flow. It is suitable for screen printing or blade coating. The syringe package can be dispensed on standard dispensing equipment, which has high operation convenience and efficiency.
Features & Benefits:
High thermal conductivity, low thermal resistance, excellent wettability;
Soft, unstressed, with infinite compression of the thinnest 0.1mm;
No settlement, no flow, can fill any uneven gap;
The design is convenient and can be used to adjust the size of any thickness.
Typical Applications:
Communication equipment
Radio equipment
Automotive electronics
Case or related cooling module
Mainframe and small office networking equipment
LCF series liquid gap filler is a two-component pre-formed thermal conductive material, which can react and cure under normal temperature or high temperature conditions to form soft and excellent thermal conductivity elastomer. It is shaped according to the shape of the structure and is equal to thermal silicone pad after curing completely. Mainly meets the requirements of low pressure and high compression modulus; Can realize automatic dispensing production with high efficiency; Good contact with electronics when assembled, maximize effective contact area and reduce the contact thermal resistance; Automatically fill the gap available, and the infinite compression feature is suitable for the heat dissipation modules or electronic components with large thickness variation.
Features & Benefits:
High thermal conductivity, low thermal resistance, excellent wettability
Low pressure to electronic components
Manageable raw material stock ,lower composite cost
For vehicle electronic products
Can fill any uneven gaps
Automatic point dispensing available, any thickness or size available
High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.
Unlike adhesive glue, thermal conductive gel has weak adhesion
Typical Applications:
Communication equipment
Power equipment
Medical instrument
New energy vehicle
Filling any gap between friable component
and shell
For more , please kindly feel free to contact rita(at)szutd.com
LE series thermal grease has good thermal conductive performance and reliability and can wet the surface of copper and aluminum which is extremely suit for the heat transfer of the CPU, GPU and other heating power components. As LE series has low adhesion, can fully wet the surface, form very low surface thermal resistance, it can quickly transfer the heat to cooling device. Just paste the grease on the gap between the power components and cooling device to help dismiss the air gap and enlarge the heat flow, decrease thermal resistance, reduce the temperature of power components, improve reliability and extend the usage life
Typical Applications:
Between Semiconductor and heatsink
Between CPU and heatsink
Between power resistor and base
Thermoelectric cooler
The surface of temperature regulator and assembly
High-power LED lighting
For more , please kindly feel free to contact rita(at)szutd.com
The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sinks performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module. The phase change characteristics: the material is solid in room temperature and installation is completely convenient, used between heatsink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material cannot
Features & Benefits:
Low heat resistance and low stress
Natural sticky, easy to use-no need to use glue
No radiator preheating
Flow but not silicon oil
Low volatility--less than 1%
High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.
Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive
For more , please kindly feel free to contact rita(at)szutd.com
LCF series liquid gap filler is a two-component pre-formed thermal conductive material, which can react and cure under normal temperature or high temperature conditions to form soft and excellent thermal conductivity elastomer. It is shaped according to the shape of the structure and is equal to thermal silicone pad after curing completely. Mainly meets the requirements of low pressure and high compression modulus; Can realize automatic dispensing production with high efficiency; Good contact with electronics when assembled, maximize effective contact area and reduce the contact thermal resistance; Automatically fill the gap available, and the infinite compression feature is suitable for the heat dissipation modules or electronic components with large thickness variation.
Features & Benefits:
High thermal conductivity, low thermal resistance, excellent wettability
Low pressure to electronic components
Manageable raw material stock ,lower composite cost
For vehicle electronic products
Can fill any uneven gaps
Automatic point dispensing available, any thickness or size available
High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.
Unlike adhesive glue, thermal conductive gel has weak adhesion
Typical Applications:
Communication equipment
Power equipment
Medical instrument
New energy vehicle
Filling any gap between friable component
and shell
For more , please kindly feel free to contact rita(at)szutd.com
Used on screw insulation sleeve;
Locked on transistor to avoid short circuit between the cooling fins of the crystal shell.
Ultra-high thermal conductive silicone sheet is a high-performance heat conducting interface material made of 100% imported materials for fillingthe air gaps between the heating device and the heat sink or metal base.Its softness and elasticity characteristics enable it to be used for coveringa very uneven surface. Heat is transferred from the separation device or the entire PCB to the metal casing or diffuser to improve heat dissipationand improve the efficiency of heating electronic components and service
Features & Benefits:
High thermal conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect sensitive electronic devices
Natural sticky, easy assembly, re-workable
Meet ROHS and UL environmental requirements
Typical Applications:
CPU, memory module
Communication hardware equipment
High-speed hard disk drive
Automotive engine control module
Microprocessors, memory chips and graphics processors
Military electronic equipment
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LCS thermal conductive silicon tube is a kind of tube silicone products which is made through special processing, adding ceramic thermal conductive powder in the form of high polymer. Because of its good thermal conductivity, insulation, softness, shockproof and easy install ect. characters, they are widely used in heating transistor, diode, audion and take main function of thermal conductive and insulation protection. Just directly install it on heating transistors when you use. The installation is easy and convenient. It is suggested apply under low compress.
Features & Benefits:
Resistance to voltage,high cost-efficiency
Good softness,resistance to tear
High thermal conductivity
ROHS UL94-V0 compliant
Typical Applications:
Transformer
Power supply module
Transistor,diode,audion
LGS300 graphite thermal pad is a new thermal interface material. It transfers heat along the two directions, shielding heat source and components meanwhile improving the performance of consumer electronics products. The thermal impedance of LGS is very small and can completely replace the high-performance thermal grease while avoiding the shortcoming of poor and dirty thermal grease process. LGS thermal conductivity is three-dimensional, that is not only it can transfer heat between the heat source and the radiator in the vertical direction, but also in the vertical direction, which ensures that it can quickly transfer heat out in vertical direction when the partial heat is high. Therefore, LGS thermal film is very suitable in the small space to efficiently transfer heat generated by heat source.
Features & Benefits:
Ultra-high thermal conductivity, easy to operate;
Low thermal resistance
Light weight
Typical Applications:
IC ; CPU; MOS; LED; Heat sink; LCD-TV; Laptop; Communication equipment; Wireless switch; DVD; Hand-held device; Camera/digital camera; Mobile phone
