LP900 is a silicon carbide ceramic heat sink and it belongs to the micro-hole structure. Under the same unit area,it can be more than 30% porosity, greatly increasing the heat transfer area with air to enhance its cooling effect. At the same time its heat capacity is small, its heat storage is small and the heat can be more quickly to the outside world. Ceramic heat sink main features: environmental protection, insulation resistance to high pressure, efficient heat, to avoid brewing EMI problems. So it can effectively solve the electronic and home appliance industry thermal and cooling problems, while it is specially for small and medium wattage power consumption, design space pay attention to light, thin, short, small products. Whats more, it can provide technical support and application for electronic products innovative and development.
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We are a professional manufacturer dedicated in the heat sink production for over 15 years. The heat sinks we produced including power radiator, resistance radiator, frequency converter radiator, inverter radiator, power amplifier radiator, semiconductor radiator, chassis integrated radiator, plug-in chip radiator, LED radiator, forked finger radiator, chassis housing radiator, sunflower radiator, Solite state relay heat sink etc. We also can provide the best thermal solution for our customers. Model No.: KX-0102 Material: AA6063-T5/T6ï¼? AA6060ï¼? AA7005 Specification: Customized Surface Treatment: Powder Coating/Anodize/Brush/Polish/Zinc Coating/Electroplate Service: OEM Application: electric appliance
With the combination of liquid transport thermal dissipation module and vapor chamber technique, this aluminum vapor chamber heat sink is ideal for devices require more uniform heat spreading. With two ends liquid tube, each tube having a first end linked with the pipe is to connect with external heat-dissipating block which is disposed on the heat source to form a fluid loop. Kaixin aluminum is a professional heat sink provider offering one-stop comprehensive thermal solutions to customer worldwide. Model NO.: KX-0101 Material: Alu 6063-T5/6060-T6 as specification Machining Process: Drilling, sealing ring, Friction stir welding, Vacuum brazing Size: customized size Manufacturer label: OEM available
CuW75 Customized Tungsten Copper Alloy Heat Sinks WCu Spreader For LED Industry The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, heat sinks, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized. The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copperâ??s thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits. The thermal conductivity and thermal expansion characteristics of the semiconductor and the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation. The sketch shows the principle structure of a hermetically sealed electronic package. Advantages of Copper Tungsten Heat Sinks / Spreaders: Strong hardness(86~93.5HRA) High arc resistance combined with good electrical conductivity High thermal conductivity Low thermal expansion. Applicatioins of Tungsten Copper Alloy: Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits. The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers
size: od38, id18, h1.5mm(tolerance pls contact us for sure) shape: donut, ring(do you want to see photo?) application: baby milk warming cup (portable warming cup) sample: available This is a hot model,many companies are developing the warming cup with this heater!
Ceramic roller is a kind of refractory material in roller kiln, as the role of bearing and transmission in the furnace. With the development and production of ceramic, roller kiln is widely used in building sanitary ceramics, daily porcelain and specialty ceramics. The requirements of refractory material used in furnace is continuous improvement, especially for strength and high temperature mechanical properties of roller presented updated requirements. Alumina ceramic rollers is the development trend for ceramic rollers, because they fully meet the various needs of ceramic tile production, with the other advantages which other ceramic roller can not be of. Ceramic rollers project is a key component of modern industrial track kilns, and can transmiss and bear ceramic products at temperatures of up to 1300 °c Special size can be made to your order.
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Supplier: Wall Tiles, Floor Tiles, Ceramic Tiles, Vitrified Tiles, Parking Tiles, Interior And Exterior Products, Sanitaryware, Ceramic Products, Kitchen Platform Slabs, Small Interior Designer Tiles, Elevation Tiles, Etc
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