LCD thermal conductive silicon mud is short for thermal conductive mud and have good thermal conductivity and insulation. The shape likes plasticine, no flow, not be dried solid, no volatile, high and low temperature endurance, take it without adhere your hands ,high viscosity, use repeatedly, can be molded into a certain shape, easy to use. Filling between the electronic component to be cooled and the heat sink / case, contacting closely to reduce the thermal resistance, quickly and efficiently reducing the temperature of electronic components to extend the electronic component the life and improve its reliability. Because of its good filling and low price, they are widely used in LED lighting industry and also the best choice for thermal cooling of the lighting industry when selecting thermal conductive materials.
Features & Benefits:
High reliability, excellent chemical and mechanical stability
Easy to meet the requirements for thickness variation in product design
After forming is not deformed in a static use, no settlement
Thermal insulation, excellent resistance to aging
Meet the environmental requirements of ROHS and UL
Rubber sludge, plasticity, repeated use
Typical Applications:
LED 1.Integrated LED internal drive
2. Round cap screw-type LED lamp
Solar
Backlight module
LCD-TV/PDP
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Thermal gel is made of silicon resin as the base material, adding thermal conductive fillers and bonding materials in a certain proportion, and processed through a special process. It has excellent high and low temperature resistance, excellent weather resistance, radiation resistance and superior dielectric properties. Testing items Testing standard WT5921-35 Appearance Visual Blue Oil leakage(150*48H) N/A
1 High thermal conductivity to 12W/m*K, 1~6W is most common use 2 Low thermal impedance 3 Min 0.1mm thickness 4 Extrem low hardness to 5shore C 5 Extremly low density to 1.2g/cm 6 Approved supplier of Google, Oppo, Vivo
No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation This product is particularly suitable for silicone sensitive applications, offering low hardness, high electrical insulation and good thermally conductive.
No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Optical precision devices Telecommunication Industrial and medical electronics Automotive ECU This product is particularly suitable for silicone sensitive applications, offering low hardness, high electrical insulation and good thermally conductive.
Pm150 has excellent thermal conductivity and electrical insulation performance. Not only satisfy for majority Electronic products thermal insulation requirements, but also widely used in the thermal requirements that are not too high in electronic products. With the stable heat conduction performance, and the product also has the viscosity, easy to use. Pm150 is using soft silicone material heat-conducting, stable insulation performance, use in transmission Interface between the electronic equipment and heat sink, which achieve heat transfer and insulation effect. Applications: 1.Led lighting, lighting equipment 2.Household appliances lcd display 3.Between semiconductor and heat sink 4.Communication product, smart phone, tablet . 5.Desktop, notebook and other portable computer 6.Large power supply etc. Performance and characteristics: 1.High thermal conductivity, heat transfer coefficient 1.5w/m-k 2.Stable performance, low thermal resistance, effectively improve the heat transfer speed 3.Low hardness, its viscosity high, easy to use 4.By ul and v-o certification standards Specification: Standard size : 200mm*400mm, 300mm*300mm, according to customer needs cutting type. Basic thickness 0.3mm~15mm, special thickness size can be customized Its slightly viscous, if need to strengthen the adhesive can be according to customer’s requirement Product color is mass production color, special color can be adjusted to actual situation .
Place of Origin: Guangdong, China (Mainland) Brand Name: laimeisi Model Number: LMS Type: Insulation Sheet, thermal pad Material: silicone, thermal conductive insulation pad Application: High Voltage, CPU GPU Rated Voltage: 4kv Tensile Strength: 10.4Mpa Color: Blue Thickness: 0.1mm-10mm Feature: Excellent Resistance Item name: Silicone rubber thermal conductive insulation pad Certificate: ROHS Hardness: 20-50 Shores Size: Customizable
The LCV series silicon cloth is a kind of cloth production which made based on fiberglass substrate through special processing. Because of its nice thermal conductivity, insulation and convenient assembly, it widely used in electronic appliances industry. When using, you should select different thickness of the thermal conductive silicon tape to cut according to the size of the fever interface and the height of the gap. Then putting the silicon tape in the gap between the fever interface and their components gap to play as a heat-conducting medium. Features & Benefits: Heat resistance, insulation, fire prevention, shock resistance Typical Applications: Heating power components Automobile electronic heating module Power module Household appliances Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate.
LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders. With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 Long-term use. As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proof, anti-seismic, anti-corona, anti-leakage and aging .The properties are widely used for the adhesion and sealing of the electronic components with high thermal conductivity, which is a single part of the acetone oxime type, It can be cured silicone rubber and conforms to the requirements of ROHS REACH UL. Typical Applications High power LED lamps and lanterns, electrical power, microwave oven, electronic components and other industrial products of thermal conductive adhesive sealing, alternative thermal conductive silicone used in high-power electric module and radiator thermal conductivity between fixed filling adhesive, no card buckle screw, more reliable filling heat, simple process and lower cost. Applying Process 1.Surface clean : Clean the surface of the adhesive object and remove the rust, dust and oil. 2.Sizing: Twist the cap of the hose, squeeze the gel into the clean surface, and make it natural. 3.Curing: Place the bonded or sealed parts in the air while them to solidify naturally. Curing is a process from surface to the internal, within 24 hours (at room temperature and 55% relative humidity) will cure the depth of the 2 ~ 4 mm, if the site location is deeper that completely curing time will be postpone, especially it is not easy to come into contact with air. if the temperature is low, cure time also will be postpone .Prior to further processing or wrapping the bonded parts, it is recommended that the user wait long enough to ensure that the adhesion and integrity of the adhesion are not affected. For more , please kindly feel free to contact rita(at)szutd.com
High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material. Benefits: Cost-effective, high conductivity, low thermal resistance Soft and flexible, reducing the interface thermal resistance High electrical insulation to protect electronic devices Natural sticky, easy application, reworkable Meet ROHS and UL environmental requirements Applications: High thermal conductivity module new energy vehicles Microprocessors, memory chips and graphics processors Network communication equipment Car equipment, charger High-speed hard disk drive For more , please kindly feel free to contact rita(at)szutd.com