High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.
Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive

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