High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material. Benefits: Cost-effective, high conductivity, low thermal resistance Soft and flexible, reducing the interface thermal resistance High electrical insulation to protect electronic devices Natural sticky, easy application, reworkable Meet ROHS and UL environmental requirements Applications: High thermal conductivity module new energy vehicles Microprocessors, memory chips and graphics processors Network communication equipment Car equipment, charger High-speed hard disk drive For more , please kindly feel free to contact