LAYER - Double side Application For semiconductor inspection Thickness - 0.07 T Drill Min - 0.3 mm Inspection spec - Zero defect SPECIAL item for controlling - Hole tolerance [+-0.01] SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 DRILL/LAND 200/400 Inspection spec Zero defect on circuit SPECIAL item for controlling Stair-shape at inner circuit
LAYER FPCB 4 layer Application MOTOR Thickness FPCB 0.1T / MULTY 0.3T L/S 50/50 Drill LASER DRILL 0.08mm ANNULAR RING 42.5 Inspection spec Zero defect SPECIAL item for controlling Outer layer [14 layers ANNULAR RING ]
Compact size and unibody type Excellent EMI/EMC and noise properties Embedded ASIC for high accuracy Wide range(-40 to 100°C) DIN and cable type Perfect compatibility with dotech's air compressor controllers
- Convenient voice alarm recording and response set - Multiple transmission and centralized control - Various user settings - Wide range of input voltage - Auxiliary battery connection for emergency
LAYER Double side FPCB + partial PSR + SUS + CBF Application CCM Thickness 0.3T L/S 60/60 DRILL/LAND 200/350 Copper plating Inner Hole Min. 18 Inspection spec Zero defect in SUS and appearance
LAYER Double side FPCB + Partial PSR Application SENSOR Thickness CON. 0.2T L/S 125/125 LASER Drill 50 Copper plating Hole inner Min. 25 Inspection spec Not allowing damage on copper plating part SPECIAL item for controlling Stair-shape at Copper plating neighboring area Apply WET LAMINATION method
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 LASER CUT tolerance +-50 Surface treatment SILVER Inspection spec Zero defect SPECIAL item for controlling Film coating and resolution Will apply scale for Laser individual recognition
Trends driving the car of the future are all enabled by more complex and intelligent electronics. Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.
JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life. For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield. JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed. 1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 2. Application : GPS 3. Thickness : 1.6T 4. Machine Drill : Min. 0.2 mm 5. Laser Drill : BVH Min. 0.1 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 100 micrometer / 100 micrometer
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1 2. Application : Industrial Equipment 3. Thickness : 0.5T 4. Machine Drill : Min. 0.25 mm 5. Laser Drill : BVH Min. 0.12 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 110 micrometer/ 120 micrometer
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market 1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6 2. Application : Inspection equipment of Semiconductor 3. Thickness : 0.5T 4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH 5. Machine Drill : Min. 0.25mm 6. Cu Plating : VIA FILL + PTH 7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
