PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100