LAYER - Double side
Application For semiconductor inspection
Thickness - 0.07 T
Drill Min - 0.3 mm
Inspection spec - Zero defect
SPECIAL item for controlling - Hole tolerance [+-0.01]
SPECIAL item for controlling - Space between line [+-0.02]
PIXEL 8M 13M 16M 20M
Flatness & Tilt Special :30
Thickness 0.25T ~ 0.45T
Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA
Machine Drill Min. 0.15mm
Laser Drill BVH Min. 0.10mm
Cu Plating 18[+-3] / PTH or Via Fill
BGA PITCH 0.4mm Under
LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2]
PSR BLACK , BLUE , GREEN
Surface treatment ENEPIG
Stiffner PI , SUS
Other EMI
Impedance 100
LAYER FPCB S/S
Application Medical equipment
Thickness 0.06T
L/S 50/50
DRILL/LAND 200/400
Inspection spec Zero defect on circuit
SPECIAL item for controlling Stair-shape at inner circuit
LAYER Double side FPCB + partial PSR + SUS + CBF
Application CCM
Thickness 0.3T
L/S 60/60
DRILL/LAND 200/350
Copper plating Inner Hole Min. 18
Inspection spec Zero defect in SUS and appearance
LAYER Double side FPCB + Partial PSR
Application SENSOR
Thickness CON. 0.2T
L/S 125/125
LASER Drill 50
Copper plating Hole inner Min. 25
Inspection spec Not allowing damage on copper plating part
SPECIAL item for controlling
Stair-shape at Copper plating neighboring area
Apply WET LAMINATION method
LAYER FPCB S/S
Application Medical equipment
Thickness 0.06T
L/S 50/50
LASER CUT tolerance +-50
Surface treatment SILVER
Inspection spec Zero defect
SPECIAL item for controlling
Film coating and resolution
Will apply scale for Laser individual recognition
Trends driving the car of the future are all enabled by more complex and intelligent electronics.
Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.
JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life.
For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield.
JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed.
1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10
2. Application : GPS
3. Thickness : 1.6T
4. Machine Drill : Min. 0.2 mm
5. Laser Drill : BVH Min. 0.1 mm
6. Cu Plating : HOLE Min. 25 micrometer
7. L/S : 100 micrometer / 100 micrometer
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market
1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6
2. Application : Inspection equipment of Semiconductor
3. Thickness : 0.5T
4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH
5. Machine Drill : Min. 0.25mm
6. Cu Plating : VIA FILL + PTH
7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
![Jig Spec For Semiconductor Inspection [fpcb D/s]](https://d2oel0jzphnd1z.cloudfront.net/go4App/no-image.png?format=webp)
