Hdi Rigid Flexible Manufacturing Spec

Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market 1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6 2. Application : Inspection equipment of Semiconductor 3. Thickness : 0.5T 4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH 5. Machine Drill : Min. 0.25mm 6. Cu Plating : VIA FILL + PTH 7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch

LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100

PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100

Ezpcb capability: Layers:1-40 Materials:fr-4, fr-1, cem-1, cem-3, teflon, rogers, al base Max. Board size:550mm x 710mm Board thickness:0.15mm-5mm Finished copper thickness:1/2oz-10oz The min. Track:3mil (0.075mm) The min. Clearance:3mil (0.075mm) The min. Hole diameter:0.10mm Finish:hasl, gold plated, immersion gold/silver Vacuum packing, box

Place of origin: taiwan Base material: varied Copper thickness: 0.45 mils - 14 mils Annular ring: 1.5 mils Inner line width:

Brand Name: strongtimes Number of Layers: 4 Base Material: FR-4 Copper Thickness: 3mil Board Thickness: 1.6mm Min. Hole Size: 4mil Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: lead free hal Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided, double-sided and multilayer PCB of high precision, high density and high reliability.

Brand Name: strongtimes Number of Layers: 4 Base Material: FR-4 Copper Thickness: 3mil Board Thickness: 1.6mm Min. Hole Size: 4mil Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: lead free hal Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided, double-sided and multilayer PCB of high precision, high density and high reliability.

IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added

Layers: 1-4l Copper weight: 0.5-2 oz Board thickness range: 0.06-0.3mm Overlay thickness range: 1/0.5mil Tracks and space standard: >= 0.1mm (4mil) Surface finishes: osp, enig and gold-plated