LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10
Application GPS
Thickness 1.6T
Machine Drill Min. 0.2mm
Laser Drill BVH Min. 0.1mm
Cu Plating HOLE Min. 25
L/S 100/100
PSR GREEN
Surface treatment ENEPIG, ENIG
Impedance LAYER 1L, 4L, 8L, 10L
Impedance spec 50 / 100
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed. 1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 2. Application : GPS 3. Thickness : 1.6T 4. Machine Drill : Min. 0.2 mm 5. Laser Drill : BVH Min. 0.1 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 100 micrometer / 100 micrometer
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
Brand Name: strongtimes Number of Layers: 4 Base Material: FR-4 Copper Thickness: 3mil Board Thickness: 1.6mm Min. Hole Size: 4mil Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: lead free hal Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided, double-sided and multilayer PCB of high precision, high density and high reliability.
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added
Layers: 1-4l Copper weight: 0.5-2 oz Board thickness range: 0.06-0.3mm Overlay thickness range: 1/0.5mil Tracks and space standard: >= 0.1mm (4mil) Surface finishes: osp, enig and gold-plated
Materials: fr-4, cem-3, high tg, fr4 halogen-free and rogers Surface finish/treatment: hasl/lead-free hasl, immersion gold plating, silver, tin or osp Layers: 1 to 16 Board finished thicknesses: 0.4 to 3.2mm Minimum hole size: 4 mils (0.1mm) Minimum trace width/space: 3.5 mils
Material: FR4, High TG FR4 Rogers 4003,4350,Al Aluminum metal base,Taconic,Halogen Free material, CEM-3,Fr2,CEM-1,CEM-2,94VO, Rogers HF material, Polymide,Flexible PCB FPC etc. Layer counts: 1-40 layers, (Normaly is double side and Multilayer PCB) Finished Copper Thickness: 0.5-5 OZ Finished Board Thickness: 0.2-6.0mm Min. Line/Track Width: 4mil Min. Line/Track Space: 4mil Min. Contour Tolerance: +/-0.1mm Min. Finished Diameter of PTH Hole: 0.1mm Max. Board Thickness/Hole Ratio: 12:1 Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil) Min. Legend(Silkscreen) Track Width: 5mil Min. Legend(Silkscreen) Height: 30mil Min. drilling slot size: 0.6mm Solder mask color: green, black, blue, white, yellow, purple, and matt, etc. Solder mask hardness: 6H Legend/Silkscreen Color: white, yellow, black, etc. Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc. Other Technology: Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc. Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micor metallographic section analysis, etc. Wrap and twist: ¡¡¡¨¬10.7% Flammability: 94V-0 High Density PCB, Impedance control PCB, Buried & Blind Via, Gold Finger PCB, Gold Plating PCB,Immersion Golde surface, HASL surface.Heavy Copper PCB, Rogers PCB,Rigid Flex PCB, Teflon PCB, Halogen Free PCB, High TG PCB(High Temperature PCB), HF PCB(High Frequency PCB); Aluminum PCB(Metal Base PCB) with UL certification STRONGTIMES Electronics offers PCB manufacture service, including: Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, Aluminum PCB. fabricate boards with 2-12 layers and more. PCB assembly, and Products are applied to a wide range of High-tech industries such as: LED, telecommunication, android tv box, MID, tablet PC, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics. main market: North America, Oceania, Southeast Asia,Eastern Europe,Africa,Hong Kong/ Macao/ Taiwan; Latin America,Japan & Korea,Mainland China,Western Europe,Northern Europe,South Asia,Middle East etc.pcbmaking.com Quality Policies Quality First All work shall be done Properly from the start Continuous Improvement
Flex part 4layer pcb Polymid Pcb thickness: 0.15mm Yellow coverlayer White silkscreen Surface treatment: enig Min line/space: 6/6mil Min hole: 4mil Rigid part 8layer pcb Pcb thickness: 0.8mm Green solder mask White silkscreen Surface treatment: enig Min line/space: 8/8mil Min hole: 6mil Brand name: syspcb