Thermally Conductive Adhesive And Grease

Key Features 1.It has a high thermal conductivity 2.Excellent comprehensive properties, elasticity, non-yellowing, no bleed oil 3.Moisture, dirt and other atmospheric composition proof 4.Relieving the mechanical stress and tension that cased by machinery, heat shock and vibrate 5.Good corona resistance and electrical insulation performance 6.Excellent outdoor aging-resistance for 20-30 years 7.Stable mechanical and electrical properties between -60- C Typical Applications Used for sealing LED lamps, thermal dissipation of auto electrical components, PCB and other heat dissipation components. Gap filling between power transistor, diode thyristor and substrates. Technical Data Table PROPERTY STANDARD/UNITS VALUE Before curing SI1316 SI1317 Color Visual inspection White Viscosity 25 227;C, mPa 8226;s Paste Density 25 227;C, g/cm3 1.65 2.25 Tack free time 25 227;C, 55%RH, min 2~5 2~5 After cured Hardness Shore A 50 1615 Thermal conductivity W/m.K 0.82 1.50 Elongation at break % 150 100 Tensile strength MPa Y1 90 Y2 Shear strength MPa, iron/iron Y1 Y2 Dielectric strength kV/mm, 25 227;C 20 20 Loss factor 1 MHz, 25 227;C 0.09 0.09 Dielectric constant 1 MHz, 25227;C 2.9 2.9 Volume resistance (DC500V) | 8226; cm 2.01014 2.0 1014 SI1316. 310ml/tube, 25 tubes/carton; 100ml/tube, 100 tubes/carton. SI1317. 310ml/tube, 25 tubes/carton

1.color white,grey 2.thermal conductivity:1 8 w/m.k 3.working temp:-40 220 4.shelf life:12 M

DB118 This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip

SECrosslink-8801 UV cured conductive adhesive, low temperature resistance, aging resistance, flexibility, low Tg. Brand SECrosslink Type SECrosslink-8801 Curing method UV energy Resin acrylate Silver content 78% Viscosity 40000cPs UV wavelength 365 nm Irradiation time 10 s Shearing strength 8 MPa Volume resistivity

SECrosslink-6260 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices. Brand SECrosslink Type SECrosslink-6260 Curing temperature 150 /1 h Resin types Epoxy Thermal conductivity 5 w/mK Tg 220 Feature high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices Content of effective elements 90% Appearance Silver gray Usage temperature -30 - 260 Silver content 89% Viscosity 40000CPS Shearing strength 25MPa Storage T -10 - 0

SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding. Brand SECrosslink Type SECrosslink-6261 Curing condition 200 /40 min ECA types Nano-silver Silver content 92% Viscosity 32000CPS Thermal conductivity 150 w/mK Shearing strength 35MPa Silver content 91% Application Die attach Appearance Silver gray Usage temperature -30 - 400

Technical specifications of conductive adhesive tape Shield efficiency,impedance of clip measurement are the best,it can be used for the high Radiation instruments of electronic industries,medical industres,electromagnetism,special shield cloth of shield room and special cloth of shield parts in IT industry.

LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders. With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 Long-term use. As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proof, anti-seismic, anti-corona, anti-leakage and aging .The properties are widely used for the adhesion and sealing of the electronic components with high thermal conductivity, which is a single part of the acetone oxime type, It can be cured silicone rubber and conforms to the requirements of ROHS REACH UL. Typical Applications High power LED lamps and lanterns, electrical power, microwave oven, electronic components and other industrial products of thermal conductive adhesive sealing, alternative thermal conductive silicone used in high-power electric module and radiator thermal conductivity between fixed filling adhesive, no card buckle screw, more reliable filling heat, simple process and lower cost. Applying Process 1.Surface clean : Clean the surface of the adhesive object and remove the rust, dust and oil. 2.Sizing: Twist the cap of the hose, squeeze the gel into the clean surface, and make it natural. 3.Curing: Place the bonded or sealed parts in the air while them to solidify naturally. Curing is a process from surface to the internal, within 24 hours (at room temperature and 55% relative humidity) will cure the depth of the 2 ~ 4 mm, if the site location is deeper that completely curing time will be postpone, especially it is not easy to come into contact with air. if the temperature is low, cure time also will be postpone .Prior to further processing or wrapping the bonded parts, it is recommended that the user wait long enough to ensure that the adhesion and integrity of the adhesion are not affected. For more , please kindly feel free to contact

SECrosslink-6061 is two-component, conductive adhesive cured at room temperature, high conductivity, high temperature resistance, impact resistance, high bonding strength, no solvent, etc. Brand SECrosslink Type SECrosslink-6061 Curing method Room Temperature Curing Adhesive types Epoxy Substrate NO Solvent Solvent-free Feature Quick curing conductive adhesive at room temperature (4 hours) Application Electronics and semiconductors Content of effective elements 100% Appearance A Metal colour B silver grey Viscosity 80000cPs Shearing strength 15MPa Volume resistivity 0.0001©cm Curing time 4h/25 Hardness Shore A 86 Storage T 0-10