SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding. Brand SECrosslink Type SECrosslink-6261 Curing condition 200 /40 min ECA types Nano-silver Silver content 92% Viscosity 32000CPS Thermal conductivity 150 w/mK Shearing strength 35MPa Silver content 91% Application Die attach Appearance Silver gray Usage temperature -30 - 400
SECrosslink-8801 UV cured conductive adhesive, low temperature resistance, aging resistance, flexibility, low Tg. Brand SECrosslink Type SECrosslink-8801 Curing method UV energy Resin acrylate Silver content 78% Viscosity 40000cPs UV wavelength 365 nm Irradiation time 10 s Shearing strength 8 MPa Volume resistivity
SECrosslink-6260 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices. Brand SECrosslink Type SECrosslink-6260 Curing temperature 150 /1 h Resin types Epoxy Thermal conductivity 5 w/mK Tg 220 Feature high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices Content of effective elements 90% Appearance Silver gray Usage temperature -30 - 260 Silver content 89% Viscosity 40000CPS Shearing strength 25MPa Storage T -10 - 0
SECrosslink-6160 low temperature fast curing weldable conductive silver paste, single component, high Tg, high temperature resistance, good weldability - pass the weldability and weldability test, excellent contact resistance, high adhesion, suitable for screen printing process. Brand SECrosslink Type SECrosslink-6160 Curing method Heat curing 100 Adhesive types Epoxy Silver content 91% Viscosity 40000CPS Feature Low temperature quick curing, weldable conductive adhesive, strong welding tension Application Glass electrode, ceramic thermal resistance Content of effective elements 99.6% Welding tension >1MPa (Vertical tensile strength) Welding temperature 275- 300 Weldability good
SECrosslink-5700 low-temperature rapid curing, printing lines with excellent flatness, no burrs, thin line width, thin thickness, very low volume resistivity, good adhesion to glass, PET and other materials, in line with the EU and other environmental requirements. Brand SECrosslink Type SECrosslink-5700 Curing temperature 100 appearance Silver gray Content of effective elements 90% Volume resistivity 0.0000©cm Shelf life 12 months Product grade Excellent Storage method -10-0 Adhesive force Excellent
SECrosslink-6061 is two-component, conductive adhesive cured at room temperature, high conductivity, high temperature resistance, impact resistance, high bonding strength, no solvent, etc. Brand SECrosslink Type SECrosslink-6061 Curing method Room Temperature Curing Adhesive types Epoxy Substrate NO Solvent Solvent-free Feature Quick curing conductive adhesive at room temperature (4 hours) Application Electronics and semiconductors Content of effective elements 100% Appearance A Metal colour B silver grey Viscosity 80000cPs Shearing strength 15MPa Volume resistivity 0.0001©cm Curing time 4h/25 Hardness Shore A 86 Storage T 0-10
SECrosslink-6062 low-temperature rapid curing, single component, high silver content, low volume resistivity, good adhesion to glass, ceramics, silicon wafers, flexible polymer materials, suitable for screen printing process. Brand SECrosslink Type SECrosslink-6062 Curing temperature 100 Content 75% Content of effective elements 90% Volume resistivity 0.00009©cm Appearance Silver gray Shelf life 12 months Product grade Excellent Storage method -10-0
SECrosslink-7800 low-temperature sintered type, weldable, suitable for glass electrode, ceramic thermal resistance and other areas requiring extreme temperature resistance. Brand SECrosslink-6 Type SECrosslink-7800 Sintering temperature 650 Resin epoxy Silver content 91% Viscosity 40000cPs Volume resistivity 9 ©*cm Usage temperature -30 - 800 Adhesive force excellent Feature Low temperature sintering, high adhesion, good electrical conductivity
SECrosslink-6063 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process. Brand SECrosslink Type SECrosslink-6063 Product Low temperature curing type conductive silver adhesive Curing temperature 100 Adhesive types Epoxy Application Electronics and semiconductors Appearance Silver gray Density 4.5g/cm3 Content of effective elements 87% Volume resistivity 0.00005©cm Curing time 0.5h Shelf life 6 months
SECrosslink-7503 fast curing, single component, weldability - meets weldability and weldability test, excellent contact resistance, high adhesion, suitable for screen printing process, used in photovoltaic solar energy and other electronic fields. (HJT solar battery) Brand SECrosslink Type SECrosslink-7503 Product name HJT silver paste Resin type epoxy Appearance Silver gray Application HJT solar paste Density 4.6g/cm3 Adhesive force excellent Silver content 91% Volume resistivity < 7 ©*cm Silver content Cured paste 99.5% Peeling strength 1.5 N Thermal conductivity 156 w/mK Usage T -30 - 300
