SECrosslink-6061 is two-component, conductive adhesive cured at room temperature, high conductivity, high temperature resistance, impact resistance, high bonding strength, no solvent, etc. Brand SECrosslink Type SECrosslink-6061 Curing method Room Temperature Curing Adhesive types Epoxy Substrate NO Solvent Solvent-free Feature Quick curing conductive adhesive at room temperature (4 hours) Application Electronics and semiconductors Content of effective elements 100% Appearance A Metal colour B silver grey Viscosity 80000cPs Shearing strength 15MPa Volume resistivity 0.0001©cm Curing time 4h/25 Hardness Shore A 86 Storage T 0-10