SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding. Brand SECrosslink Type SECrosslink-6261 Curing condition 200 /40 min ECA types Nano-silver Silver content 92% Viscosity 32000CPS Thermal conductivity 150 w/mK Shearing strength 35MPa Silver content 91% Application Die attach Appearance Silver gray Usage temperature -30 - 400
