ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Deposition Direction Downward Plasma Source RF & VHF Power Supply Process Gas Any of Requested Gas based on Ar,O2 Process Temperature ~ 700 C Uniformity ±3% Heating Uniformity ±3% Full Automation Control, Load Lock System.
ITEM DESCRIPTION Substrate Size ~ 6inch Deposition Direction Downward Process Gas Any of Requested Gas Process Temperature ~ 700 C on Substrate Source Heat Bubbler for Mo Source Thickness Uniformity ±5% Heating Uniformity ±3% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 200mm (Option) Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 12.5 inch Etching Direction Downward Process Gas Any of Requested Gas Based on Ar,O2,CF4,SF6 Etching Uniformity ±5% Load Lock System, Full Automation Control
ITEM DESCRIPTION Substrate Size ~ 8inch Deposition Direction Upward E-BEAM Source ~ 15kw Thickness Uniformity ± 3% Heating Uniformity ± 3% Full Automation Control
ITEM DESCRIPTION Consisting of Evaporation,Sputter,Parylene,Glove Box,Loadlock Tact time 20~80 min Depends on the number of mask Loading Capacity Glass 1 Sheet, Mask 4 Sheet Transfer Methode Vacuum Robot Plasma Treatment Optional Evaporation Source for Organic (5ea) 10cc for host, 4cc for dopant Evaporation Source for metal (2ea) Thermal Source, E-Beam is optional Deposition Uniformity Organic, Metal, Sputter less than ±3% Max. deposition rate Organic 5A/sec, metal 10A/sec Rate Accuracy Organic ±5%, Metal ±7% Thickness reliability Organic & Metal ±5% glass to glass Conductive Oxide Low Damage Sputtering (FTS or General Sputter) Doping ratio less than 1% at 1A/sec of host.
ITEM DESCRIPTION Substrate Size 125mm² 16pcs, 156mm² 9pcs Heating Source Halogen Lamp Deposition Direction Up or Downward Process Temp ~ 1100 C Heating Uniformity ±5% Sustain Time More Than 2min. at 1100 Lamping Rate 10 to 20 C / sec Cooling Rate 5 to 20 C / sec Gas mixing capability with MFC .
ITEM DESCRIPTION Substrate Size 2 inch Heating Source Halogen Lamp Deposition Direction Up or Downward Process Temp ~ 1000 C Heating Uniformity ±3% Toggle Switch Control or Touch Panel Control.
Light Cured Universal Nano Hybrid Composite Fusion Universal is visible light cured, radiopaque highly filled, fine hybrid composite restorative material for all cavity classes of anterior and posterior teeth. Indications Direct restoration of all cavity classes in anterior and posterior teeth Preventive resin restoration and repairs of composite ceramic veneers Correction of shape and shade for better aesthetics Core build-up & Composite inlays Product Benefits Excellent physical properties for long lasting restorations Lower polymerization shrinkage than conventional composites High filler contents Extremely high abrasion resistance
Machinery..
Glass facade systems including insulated glass systems, tempered glass, laminated glass, sentry glass, heat soak tested glass, aluminium systems of building, facade, industrial applications with new mold and extrusions..Shipping and transsportation
Various types of machinery and production lines. tires and accessories for cars, motorcycles and tractors,ships. food and additives. minerals, metals and alloys. medical equipment, chemicals..
Home composters community composters composting tools, consumables & accessories.
All type of stocks and machinery.
Machinery
Dary.-500kl.To 100000kl. Tank. Pharma.-oll tiyp riyacatrs mob.Van.Farmantrs ani type As.Per ricwermant.
Machinery We have a team of design engineers who study a unit and then design special cleaning units specific to the process. We also design the brushes accordingly.
Machinery.
Machines And Heavy Duty Machines.Trading agent