Led Applications 1. Photo interrupters 2. Photo couplers 3. Indication of all kinds 4. Board for display 5. Traffic signal light
Cut crab E is cuting 700g
Discrete semiconductor devices We are a new own design base manufacturer for mosfet, triac, scr and transistor in korea who had Launched biz since 2003. Our tech for mosfet 1. Stripe d-mos 2. Trench
Textile fabrics.
Rattan craft.
Disposable Hotpack ( Body Warmer And Handy Warmer).
Sports goods.Exporter, importer
Bolting cloth, screen mesh, screen printing cloth.
An old sleeper .
Metals, metal ores.
Glucose meter, cholesterol meter, HBA1C, disinfectant wipes, auto tube labeler.
Sapphire ingots.
Textile felt.
Sterilizer.
LAYER - Double side Application For semiconductor inspection Thickness - 0.07 T Drill Min - 0.3 mm Inspection spec - Zero defect SPECIAL item for controlling - Hole tolerance [+-0.01] SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
