Access control, security, hardware, software, RFID reader.
Industrial / rugged PDAs, handheld computers, mobile RFID readers.
Monitor for computer.
Remote control receiver module Applications 1. Optical remote control for any kinds of goods 2. TVs, VCRs, audios, cars, air conditioners, toys, fans
Infrared emitting diode Applications 1. Emitters of remote control for TV, VCR, audios, toys, air conditioners car electronics, wireless headphone. 2. Automatic focusing of cameras. 3. Optoelectronic switches. 4. Tape readers. 5. Card readers.
Led Applications 1. Photo interrupters 2. Photo couplers 3. Indication of all kinds 4. Board for display 5. Traffic signal light
Discrete semiconductor devices We are a new own design base manufacturer for mosfet, triac, scr and transistor in korea who had Launched biz since 2003. Our tech for mosfet 1. Stripe d-mos 2. Trench
Home supplies, electronics.
Check scanner, card scanner, passport scanner, card reader and combined ID scanner, check scanner.
Motherboards Scraps, Keyboards Scrap, Cd Rom Scraps, Hard Disks Scraps, Monitors Scraps, Electronic Boards Scraps.
LAYER - Double side Application For semiconductor inspection Thickness - 0.07 T Drill Min - 0.3 mm Inspection spec - Zero defect SPECIAL item for controlling - Hole tolerance [+-0.01] SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 DRILL/LAND 200/400 Inspection spec Zero defect on circuit SPECIAL item for controlling Stair-shape at inner circuit
Indoor Lighter & Slimmer Commercial LED Display There are big led video wall in shopping mall, studios we call it ,it used for commercial advertising. have full solution for retails and more Modulesize 250 250mm Cabinetsize 1000 250mm 750 250mm 500 250mm Only45mmthickness withmodule 59mm 7.8kgpercabinet 1000 250mm 6.1kgpercabinet 750 250mm 6.1kgpercabinet 750 250mm 4.1kgpercabinet 500 250mm Normal brightness from800 1,200nits, and high brightness upto3,000nits Wide applications for shopping malls, retail stores,bars, reception area, showrooms, stadiums,etc.
Dear Sir/ Madam, We are a trader of Semiconductor Chips We handle various types of semiconductor chips and supply only 100% authorized products. If you are interested, please let us know the following information for your needing semiconductor chip. 1. Manufacturer 2. Part No 3. Quantity We hope to do business with your company.
Semiconductor : Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process Features of the product - Si Wafer Damage Relief design - Damage area minimizing design and Wheel design considering Ra - Guttering effect Wheel design
