1) SMT solder paste stencil 2) 12" x 12" to 28" x 28" 3) With /without aluminium frame 4) 100% Laser cut (Chemical etch is optional) 5) Stencil thickness 0.05mm-0.2mm 6) Fiducal mark backside half-etch Vaccum bags.
Bicheng provides RD, high-tech, IT research companies and organizations, large and small with PCB prototypes. It covers: 1) 1-32 Layers, 0.3-6mm thick, Heavy copper (2-10 oz) 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn delivery 10) MOQ: 1 PCS. Packing: Vacuum bag and carton box outside Max. 25kg/ctn.
Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's. It covers: 1) 4-32 Layers, 0.5-6mm thick 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn prototype 10) Small and volume production. Vaccum bags.
PCB copy, PCB changing, schematic diagram designing, PCB layout, BOM list making, prototype manufacturing (including debugging), the batch processing of finished product, technical support, quality assurance of PCB production, according to the requirements of our customers.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
1. Touch switch 2. Chramatic light 3. With flip fuction 4. LCD screen.
1. Touch switch 2. With self-locking function 3. LCD screen.
1. Touch switch 2. With spark linkage function 3. LCD screen.
1. Touch switch 2. Three speed 3. Smoke detection system 4. With remote control 5. LCD screen.
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au: min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au: min. Gold fingers/Au:30u Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/ODM.
Layers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/space: 8/5.9 miles, Thickness: Rigid board: 2.00mm, Flex board: 0.24mm Size: 397.89 x 555mm.
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
We are a company in shaanxi province provide all series elevator parts such as PCB, Comb plate, guide rail, guide shoe, buttom, swith, oil can, door vane, wheel etc for Fuji, Selcom, LG-OTIS, KONE, SCHINDLER, MITSUBISHI and other famours brand.
Surface treatment:OSP,Shen JIn,Shen tin,Shen silver,Lead-free,spray tin,nickel gold plating. Layers:1-4 layer Width of smallest wire:0.1©L Minimum spacing wire:0.1©L. Pack in carton; each is lined with waterproof paper, so that can not be spoiled by dampness or rain.
Layer count: 4 Surface treatmeat: osp Soldermask color: green Silkscreen color: yellow Final board thickness: 1.60mm. Minimum line width/space: 0.10/0.12mm. Minimum via hole: 0.30mm.
This kind of pcb board is FR-4 meterial, with gold immersion and gold finishing.
MCPCB with high thermal conductivity with superior aluminum substrate. As per order.
1. Rigid PCB board 2. Attained UL ,ISO,CQC certificate 3. IPC Class 2 standard 4. 8-9 working days for printed circuit board. Inner : vacuum packing/plastic bag Outer : standard carton packing.
