Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's.
It covers:
1) 4-32 Layers, 0.5-6mm thick
2) High Tg 170, High CTI 600V
3) Impedance control +/-10%
4) 1+C+1 HDI, Buried/blind vias
5) Half hole, Via in pad, countersink hole
6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask
7) Rogers and FR-4 combination PCB.
8) BGA, CSP, QFN
9) Quick turn prototype
10) Small and volume production.
Vaccum bags.