Specification: 6L
Material: FR-4 TG170
Board thickness: 1.6mm
Final copper: 35um
Solder mask color: Blue
Surface Finish: Immersion Gold, Au: min. Impedance control
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection.
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Board thickness: 1.60mm Copper thickness: 0.5OZ Minimum line width/space: 3/3 mil Minimum drilled hole diameter: 0.25MM Surface finish: ENIG Special process: 50 ohm impedance control
Supplier: Medical cable, extrusion, cable, wire, connector, cable assembly, wire harness, pvc, hdpe, pp, ldpe, pcb, pcba, injection mold, injection molding, fixture, machining part, stamping part, tube, catheter, wire harness, release paper, release liner, flim, tape, silicone foam, sponge
Services: Export and shipping
6 layer hight PCB, OEM design PCB 1) Thickness: 0.1mm-5mm 2) Minimum linewidth:0.075mm/3mil 3) Minimum gap:0.065/2.8mil 4) Minimum aperture inradium:0.15mm 5) Minimum aperture external diameter:0.45mm 6) Minimum BGA:0.2mm 7) Layer 6 layers through hole non-impedance All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
Our PCB Production Capability for your reference 1) Layer: from 1 to 20 2) Board finished thickness: 0.5-6.0mm 3) Material: FR-4,CEM-1, CEM-3, High TG, FR4 Halogen Free, etc 4) Surface finish/treatment: HASL/HASL lead free, HAL, Chemical Gold/tin, Immersion Silver/Gold/Tin, OSP, Gold plating, Hard &Soft gold, Plating tin. 5) Product range: Flex-PCB, Rigid-PCB, Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers, High frequency PCB ,etc 6) Max. finished board size: Single & Double Layer:450mm*650mm Multilayer:450*500mm 7) Min. drilled hole size: 3mil(0.075mm) 8) Min. line width: 3mil(0.075mm) 9) Min. line spacing: 3mil(0.075mm) 10) Solder mask color : Green/yellow/black/white/red/blue 11) Copper thickness in hole: >20.0um (1mil) 12) Shape tolerance: plus or minus 0.13 13) Hole tolerance: PTH: plus or minus 0.076; NPTH: plus or minus 0.05 14) Certificate: UL,ISO9001,ISO14001,SGS,RoHS compliance 15) Special req. Buried and blind vias +controlled impedence +BGA 16) Profiling : Punching ,Routing ,V-CUT, Beveling. Inner: Vacuum packing/Plastic bag Outer: Standard carton packing.
6-Layer 6 Layer PCB Board, Multilayer Hasl PCB, Multilayer PCB Prototype, Multilayer PCB Assembly, 4, 8, 10, 12 Layer PCB Board, High Density Multilayer PCB, OEM PCB Supplier Layer/Board thickness: 6L/1.0mm Suface Finish: ENIG Trace/Space: 12/12mil Smallest Hole Diameter: 0.25MM PCBMAIN is an OEM PCB supplier. We can wholesale can custom multilayer hasl PCB, multilayer PCB prototype, multilayer PCB assembly such as 6 layer PCB board, 4 layer PCB board, , 8 layer PCB board, 10 layer PCB board, 12 layer PCB board.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
