Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's. It covers: 1) 4-32 Layers, 0.5-6mm thick 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn prototype 10) Small and volume production. Vaccum bags.
