Multi Layers 1-2-4 PCB Material FR-4 Available Color Green, Red, Yellow, Blue, White, Black Silk Screen White, Black (For White Solder Mask only) Maximum Size 45cm X 120cm Minimum Qty 10pcs Board Thickness 0.6mm,0.8mm, 1.0mm, 1.2mm, 1.6mm Thickness Tolerance (t=1.0mm) ± 10% Thickness Tolerance (t8mil) Minimum Track/Vias Space 6mil (Recommend >8mil) Minimum pads Space 8mil Minimum silkscreen text size 32mil Out Layer Copper Thickness 1oz(35um) Inner Layer Copper Thickness 17um Drilling Hole (Mechanical) 0.3mm—6.35mm Finish Hole (Mechanical) 0.8mm—6.35mm Drill Diameter Tolerance (unplated) 0.05mm Drill Diameter Tolerance (plated) 0.1mm Outline Tolerance (Mechanical) ±0.20mm Aspect Ratio 8:1 Solder Mask Type Photosensitive ink SMT min Solder Mask Width 0.2mm Min Solder Mask Clearance 0.2mm Solder Mask Thickness 15um Surface Finish HASL, HASL (Lead Free) +$10, ENIG+$16.
Product name: Industrial control board Low cost pcb fabrication Characteristic: 1, the board design integration is very high; 2, the need to use composite surface treatment method, gold finger plating hard gold 30 uinch; 3, gold finger position plate thickness tolerance 1.6mm+/-0.10mm, it is recommended that customers in the design of the gold finger corresponding to the inner line of the copper block, in order to facilitate the plate thickness tolerance control. Manufacturing pcb china Specifications: Layer count: 6 Board thickness: 1.60mm Base materials: fr4 s1141 Finished size: 172*148mm Surface finish: gold plated + finger Line width/line space: 5/5mil Minimum hole: 0.25mm Solder resist color: blue Cu thickness: inner layer 1 oz outer layer 1 oz
Base matrial: polyimide/polyester mertial thickness:0.025mm---0.125mm min. Hole size:0.30mm±0.02mm copper thickness:0.009mm0.018mm 0.035mm 0.070mm 0.010mm welding resistenace:85---105?/ 280?---360? min. Line space:0.075---0.09mm
Layer count:2l Base material: fr-4 Copper thickness: 1/1 oz(35/35 um) Board thickness: 1.60±0.15mm Dimension: 155.52mmx74.46mm/1up Min hole diameter: 0.40mm(16mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.15mm(6mil) Surface finishing: osp Test: fixture/flying probe Via diameter: 0.40mm(16mil) Lead time:fastest 24h, nomal 3-5wds
Layers Count:2L Base Mateial:Alu Board Thickness: 1.60±0.15mm Copper Thickness: 2/2 oz Min Hole:0.20mm(8mil) Min Trace Width: 0.5mm(19mil) Min Trace Spacing: 0.25mm(10mil) Surface Finishing: ENIG 5u' Test: Flying probe Panel Dimension: 110.00mX437.50mm/pcs Panel Method: 1up, 1*1 Lead Time:fastest 5 wds,normal 8-13wds
Part Name: ME-PCB-197-01 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 335* 245/1 up. Copper thickness : 1/1/1/1/1/1/1/1oz Surface: HASL Solder: Blue Silkscreen: White Special: hole copper 25um, blue solder mask
Layer count:20l Base material: fr-4 tg170 Copper thickness: all layers 2oz Board thickness: 3.2mm±0.3mm Min hole diameter: 0.50mm(19mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.20mm(8mil) Suface finishing: enig Test: flying probe Panel dimension: 106.63mmx134.42 mm Panel method: 6up, 2*3 Blind:dr1-2, dr3-4, 2 step blind vias Via diameter: 0.5mm(19mil) Lead time:fastest 10wds, normal 15-20 wds
Layers count:4l Base mateial: iteq tg180 Board thickness: 1.60±0.15mm Min hole: 0.20mm(8mil) Min trace width: 0.089mm(3.5mil) Min trace spacing: 0.094mm(3.7mil) Surface finishing: enig Test: flying probe Panel dimension: 157.00mmx409.55mm/pcs Panel method: 1up, 1*1 Lead time:fastest 3wds, normal 5-7wds
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material: Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil: Ed/ra Min. Line width: 2 mil Min. Line spacing: 2 mil Min. Hole size: 0.2mm Max. Board size: 800x400mm Min. Board thickness: 0.1mm Min. Solder mask thickness: 10um Solder mask types: Green, yellow, black, white, blue, red and clear Profiling: Punching, routing, v-cut Soldering thermal resistance: 300°c/10 seconds Peeling strength: =1.4kg/cm Surface resistance: 105mo Insulation resistance: 105mo Dielectric strength: 9.8x105v/cm Flammability: Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, Double-sided, Multi-layers (max 28 layers) and Rigid-flexible PCB, Aluminium board Surface Finishing: HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) Base Material:Polyimide(Kapton), Polyester(PET), Aluminium, FR4 Copper Foil:ED/RA Min. Line Width:2 mil Min. Line Spacing:2 mil Min. Hole Size:0.2mm Max. Board Size:800x400mm Min. Board Thickness:0.1mm Min. Solder Mask Thickness:10um Solder Mask Types:Green, yellow, black, white, blue, red and clear Profiling:Punching, Routing, V-cut Soldering Thermal Resistance:300°C/10 seconds Peeling Strength:=1.4kg/cm Surface Resistance:105mO Insulation Resistance:105mO Dielectric Strength:9.8x105v/cm Flammability:UL-94V-0 Performance Test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
