Osp Board

Layer count: 4 Surface treatmeat: osp Soldermask color: green Silkscreen color: yellow Final board thickness: 1.60mm. Minimum line width/space: 0.10/0.12mm. Minimum via hole: 0.30mm.

green solder mask PCB, OSP printed circuit board 1) Thickness: 0.1mm-5mm 2) Minimum linewidth 0.075mm/3mil 3) Minimum gap 0.065/2.8mil 4) Minimum aperture inradium 0.15mm 5) Minimum aperture external diameter 0.45mm 6) Minimum BGA: 0.2mm 7) Layer 4 layers through hole non-impedance  All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.

Gold OSP 6 layers mobile phone circuit board Gold OSP circuit board 1) Thickness: 0.1mm-5mm 2) Minimum linewidthï¼?0.075mm/3mil 3) Minimum gapï¼?0.065/2.8mil 4) Minimum aperture inradiumï¼?0.15mm 5) Minimum aperture external diameterï¼?0.45mm 6) Minimum BGA: 0.2mm 7) Layerï¼?6 layers through hole non-impedance  All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.

Number of Layers: 1-64-Layer Base Material: FR4,High-TG ,Rogers,Nelco,RCC,PTFE Copper Thickness: 0.3-12oz Board Thickness: 0.6-10mm Min. Hole Size: 0.03mm Min. Line Width: 0.035 Min. Line Spacing: 0.035 Surface Finishing: HASL, Immersion Gold/Tin/Silver ,OSP Board Size: 5mm*5mm-610mm*1100mm

Number of Layers: 1-14Layer Base Material: FR4 Copper Thickness: 0.5oz-6oz Board Thickness: 0.2mm-7mm Min. Hole Size: 0.2mm Min. Line Width: 0.075mm (3mil) Min. Line Spacing: 0.075mm (3mil) Surface Finishing: Immersion Gold, HASL, OSP, Enig, Gold Fingers, etc Board Size: Multilayer Quality Control: FQC, FQA Services: EMC, ODM, OEM Testing Service: Aoi X-ray Function Test Certificate: UL, TS16949, ISO9001, RoHS, SGS

Materials: fr-4, cem-3, high tg, fr4 halogen-free and rogers Surface finish/treatment: hasl/lead-free hasl, immersion gold plating, silver, tin or osp Layers: 1 to 16 Board finished thicknesses: 0.4 to 3.2mm Minimum hole size: 4 mils (0.1mm) Minimum trace width/space: 3.5 mils

Specification: Number of Layer: 1,2,4 or 6,upto 18 layerBoard Shape: Retangular,round,slots,cutouts,complex,irregular Board Type: Rigid, Flexible, Rigid-flexible Board Material: FR-4 glass epoxy, FR-4 high Tg, Rohs compliant, Aluminum, Rogers,etc Board CuttingShear: V-score,Tab-routed Board Thickness: 0.2-4.0mm, Flex 0.01-0.25mm Copper Weight: 1.0, 1.5, 2.0 oz Solder Mask: Double-sided green LPI,A lso support Red, White, Yellow, Blue, Black Silk Screen: Double-sided or single-sided in white, yellow, black, or negative Silk Screen Min Line Width: 0.006'' or 0.15mm Max Board Dimensions: 20 inch*20inch or 500mm*500mm Min Trace/Gap: 0.10mm, or 4mils Min Drill Hole Diameter: 0.01'',0.25mm, or 10mils Surface Finish: HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc. Board Thickness Tolerance: ±10% Copper Weight Tolerance: ± 0.25 oz Minimal Slot Width: 0.12'', 3.0mm, or 120mils V-Score Depth: 20-25% of board thickness Quote requirement for pcb and pcb assembly: 1)Gerber file and Bom list Gerber file,PCB file,Eagle file or CAD file all acceptable 2)Clear pics of pcba or pcba sample for us This will help a lot for the fast purchasing as request 3)Test method for PCBA This can guarantee 100% good quality products when delivered

Multi-layer PCBs, FR4, board thicknses 1.6 mm, OSP or LFHAL surface PCB.

Supplier: Product: pcb (flex board; rigid board; rigid flex boards) & pcb assembly services/stencil. type: fr 4, high tg fr 4, aluminum boards, hdi, flex, rigid flex. thickness: 0.2 3.2 mm layer: 1 26 l finished copper thickness: 1 oz 12 oz payment for net 30 days is flexible. lead time: quick turn. standard delivery is 5 days. surface treatment: hal lf, osp, enig, gold plating, immersion gold, immersion silver, immersion tin, gold finger