Flex Print Circurt

Smartphone RFPCB /Flexible PCB Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.

Rigid Flex Printed Circuit Boards: Layers : 4 Layer PCB Material: FR4 High Tg and polyimide Board Thickness: 1.6mm Surface Finishing: ENIG Finished Copper thickness: 1/1/1/1 OZ Special Process: Rigid-Flex PCB Rigid-Flex PCB Capability: Minimum Circuit Trace Width/Space: 2.7/2.7mil The Minimum Via Size : 0.15mm The Minimum legend Height/Width: 0.5mm/0.12mm Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide Maximum Panel Dimension: 1200mm x 600mm Final Board Thickness: 0.4mm ~ 6.0mm Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm Solder Mask Colour: Green White Black Red Blue Yellow Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole

Model : 10L Camera Module Rigid-Flex Board Material FR4 +PI Layer Rigid 4L + Flex 2L Copper Thickness 1OZ Finished Thickness 0.6mm Surface Treatment : Immersion Gold Min Hole :0.21mm Trace/Space :3mil/3mil

Model : 10L Camera Module Rigid-Flex Board Material FR4 +PI Layer Rigid 4L + Flex 2L Copper Thickness 1OZ Finished Thickness 0.6mm Surface Treatment : Immersion Gold Min Hole :0.21mm Trace/Space :3mil/3mil

Model : 10L Camera Module Rigid-Flex Board Material FR4 +PI Layer Rigid 4L + Flex 2L Copper Thickness 1OZ Finished Thickness 0.6mm Surface Treatment : Immersion Gold Min Hole :0.21mm Trace/Space :3mil/3mil

Technical Capability: Product type FR4+FCCL(Flexible Copper Clad Laminate)rigid flex PCB Material FR4+FCCL Field of application military industrial Layers/thickness 4L/1.2mm Line Space/width 6/6mil Surface treatment ENIG Minimum hole dia. 0.2mm Technical feature special material,rigid-flex technology

1. Rigid PCB board 2. Attained UL ,ISO,CQC certificate 3. IPC Class 2 standard 4. 8-9 working days for printed circuit board. Inner : vacuum packing/plastic bag Outer : standard carton packing.

1. Rigid PCB boards 2. Attained UL ,ISO,CQC certificate 3. IPC Class 2 standard 4. 8-9 working days for printed circuit board. Inner : vacuum packing/plastic bag Outer : standard carton packing.

1. Rigid Aluminum PCB boards 2. Attained UL ,ISO,CQC certificate 3. IPC Class 2 standard 4. 7 working days for printed circuit board. Inner : vacuum packing/plastic bag Outer : standard carton packing.