Multi-Layer Pcb

Multi-layer PCBs, FR4, board thicknses 1.6 mm, OSP or LFHAL surface PCB.

Layer count: 6 Finishing thickness: 1.575 ¡à10%mm Minimum width/spacing: 4/4-mil Minimum via diameter: 0.2mm Surface finishing: lead-free hasl Specialty: all via are filled with copper paste Board thickness: 1.2mm Vacuum package

HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK. HDI Item Mass Production Prototype HDI structure 1+N+1,1+1+N+1+1 2+N+2 Buried hole Filled Filled Aspect ratio 0.75:1 0.75:1 Minimum laser hole 0.1mm(4mil) 0.1mm(4mil) Minimum laser pad 0.25mm(10mil) 0.25mm(10mil) Blind hole No filled No filled Rigid & Flex board NO YES Press fit hole YES YES Control Depth drilling YES YES Lead-free & Halogen-free YES YES Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm Immersion Tin 0.6-1.2µm 0.6-1.2µm Immersion silver 0.2-0.6µm 0.3-0.6µm OSP 0.1-0.4µm 0.25-0.4µm HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm. HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK .

1. Number of layers: 1-12 layers 2. Base material: FR4, High TG FR4, Halogen free, Rogers, Aluminium, Cem-1, Cem-3, Ceramic, etc. 3. Copper thickness: 1/3oz ~ 6oz 4. Board thickness: 0.2 mm ~ 7.0 mm 5. Min. Line width/space: 3mil/3mil 6. Min. Hole size: 0.1 mm 7. Surface finishing: HASL, LF HASL, OSP, Immersion gold, Immersion silver, etc. 8. Impedance control: ± 10% 9. Solder mask: green, black, white, red, blue, yellow, mass black, etc . 10. Silkscreen: white, black, green 11. Hole tolerance: PTH ± 0.075 mm, NPTH ± 0.05 mm 12. PCB standard: IPC-A-610 E Class II-III 13. Profiling punching: Routing, V-cut, Beveling 14. Wrap and twist: 1% 15. Place of origin: Taiwan Ad plus corporation provides service in the comprehensive range of professional PCB manufacturing. We also passed ISO 9001:2015 certified, ISO 14001:2015, UL approved, ROHS etc. According to product of versatility, ad plus corporation is with professional cam engineers and process expertise, enabling prompt and accurate PCB manufacturing which meets with customer needs, together with strict quality control that contributes to more time- and costs-saving for the customer.

PCB -Rigid pcb:single-sided pcb, double-sided pcb, multi-layer pcb(4-30 layers) -Rigid-flexible pcb(1-16layers) -Flexible pcb(flex thickness:25um, 50um, 75um, 125um) Capability: -High frequency(taconic material)/tg/density/precision impedance controlled boards -Heavy copper pcb, metal based pcb.Hard gold pcb, blind&buried vias boards, halogen free pcb, aluminum-backed boards -Gold finger+hal&leadfree hasl pcb, leadfree compatible pcb Material: cem-1, cem-3, high tg, high cti, halogen free, rogers, taconic, argon, aluminum-backed, high frequency.

MOTOR manufacturing specification [FPCB MULTY] 1. Layer : FPCB 4 layer 2. Application : motor 3. Thickness : FPCB 0.1T / MULTY 0.3T 4. L/S : 50 micrometer/50 micrometer 5. Drill : LASER DRILL 0.08 mm 6. ANNULAR RING : 42.5 micrometer 7. SPECIAL item for controlling : Outer layer [14 layers ANNULAR RING ]

Fr-4, aluminum based, 1 to 4 layaers Carton

We offer our state-of-the art, automated rohs lead free manufacturing facility which includes pcb stacker; printer, high speed chip shooter & bga capable smt machine and ten zone nitrogen capable re flow oven for assembly / mounting of surface mount devices. ( smd soldering ). We also support leaded solder assembly & through hole component assembly with wave solder / hand solder and complete / finished product assembly. At par with the norms and guidelines laid down by the industry, we have come up with a distinctive plethora of pcb assemblies. Assembled with the best manufacturing practices and with utmost precision, these are checked on different stages of products before final dispatch. We guarantee that the quality of our products is never compromised so as to deliver them to our customers at reasonable rates.

Led lights pcb assembly according to wattage requirement.