Layers: 2L Material: FR-4 Thickness:4.8mm Copper Thickness: 3/3 OZ Board Size:38.1mm*35.6mm Min line width/spacing:8mil/8mil Surface Finishing: HAL File format: Gerber file ( RS274-X ) Min hole: 43mil (1.075mm )
Layers Count:1L Base Mateial:Alu Board Thickness: 1.0±0.15mm Copper Thickness: 1/0 oz Min Hole: 0.20mm(8mil) Min Trace Width: 0.5mm(19mil) Min Trace Spacing: 0.5mm(19mil) Surface Finishing: ENIG Test: Flying probe Panel Dimension:98mX98mm/pcs Panel Method: 1up, 1*1 Lead Time:fastest 1wds,normal 5-6wds
Base Material: FR-4+FPC, coverlay, standing PP Board Layers:2L Copper Thickness: 4/4 OZ(1OZ=35um) Board Thickness: 1.60±0.15mm Min Hole: 0.30mm(12mil) Min Trace Width: 13 mil Min Trace Spacing: 14 mil Surface Finishing: HASL Test Way: Flying Probe Min Hole: 0.30mm(12mil) Lead Time: Fastest 2wds,Normal 5-10wds
Base Material: FR-4+FPC,coverlay, standing PP(tg170) Copper Thickness: 1/0.5/0.5/1 OZ(1OZ=35um) Boar Thickness: 1.00±0.10mm Min Hole: 0.30mm(12mil) Min Trace Width: 0.15mm(6mil) Min Trace Spacing: 0.12mm(5mil) Surface Finishing: ENIG Test Way: Flying Probe Dimention: 110.74mmX88.27mm/PCS Min Hole: 0.30mm(12mil) Lead Time:Fastest 3wds,Normal 5-10wds
Layers Count:2L Base Mateial:Alu Board Thickness: 1.60±0.15mm Copper Thickness: 2/2 oz Min Hole:0.20mm(8mil) Min Trace Width: 0.5mm(19mil) Min Trace Spacing: 0.25mm(10mil) Surface Finishing: ENIG 5u' Test: Flying probe Panel Dimension: 110.00mX437.50mm/pcs Panel Method: 1up, 1*1 Lead Time:fastest 5 wds,normal 8-13wds
Layer count:2l Base material: fr-4 Copper thickness: 1/1 oz(35/35 um) Board thickness: 1.60±0.15mm Dimension: 155.52mmx74.46mm/1up Min hole diameter: 0.40mm(16mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.15mm(6mil) Surface finishing: osp Test: fixture/flying probe Via diameter: 0.40mm(16mil) Lead time:fastest 24h, nomal 3-5wds
Part Name: ME-PCB-197-01 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 335* 245/1 up. Copper thickness : 1/1/1/1/1/1/1/1oz Surface: HASL Solder: Blue Silkscreen: White Special: hole copper 25um, blue solder mask
Layer count:20l Base material: fr-4 tg170 Copper thickness: all layers 2oz Board thickness: 3.2mm±0.3mm Min hole diameter: 0.50mm(19mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.20mm(8mil) Suface finishing: enig Test: flying probe Panel dimension: 106.63mmx134.42 mm Panel method: 6up, 2*3 Blind:dr1-2, dr3-4, 2 step blind vias Via diameter: 0.5mm(19mil) Lead time:fastest 10wds, normal 15-20 wds
Layers count:4l Base mateial: iteq tg180 Board thickness: 1.60±0.15mm Min hole: 0.20mm(8mil) Min trace width: 0.089mm(3.5mil) Min trace spacing: 0.094mm(3.7mil) Surface finishing: enig Test: flying probe Panel dimension: 157.00mmx409.55mm/pcs Panel method: 1up, 1*1 Lead time:fastest 3wds, normal 5-7wds
