Silicone sealant.
The breaking strength of diamond wire is high and stable; the diamond particles is well distributed and and no agglomeration, to keep the diameter of diamond wire uniform withdifferent diamond density; strongbonding force of plating ,and there's no peeling and cracks; the coating is compact and smooth, the appearance looks silver andbeautiful. Item: Diamond wire Shape:wire Material: Imported C-steel Diameter:55μm-450μm available 24 years of history in steel wire transforming and coating Listed on Shenzhen A stock market in 2007 An annual output of 3000000 Kilometers of sawing wire ISO/TS 16949 And ISO9002 certificated
Silica, silicon carbide, silicon carbide, also known as carbon refractory sand, is made of quartz sand and petroleum coke, sawdust and other raw materials in smelting in electric resistance furnace, high temperature and be become.Green silicon carbide black silicon carbide and silicon carbide two commonly used basic varieties: (1) black silicon carbide containing SiC by about 95%, its toughness is higher than the green silicon carbide, mostly used for processing low tensile strength of material, such as glass, ceramics, stone, refractory material, cast iron and nonferrous metal, etc.;(2) the green silicon carbide containing SiC98 % above, good self-sharpening, mostly used for processing hard alloy, titanium alloy and optical glass, also used for honing cylinder jacket and fine grinding HSS cutting tools.
Green silicon carbie Green silicon carbide is produced as the same type as the black silicon carbide, except the different raw materials.Ití»s crystallization have higher purity and hardness.Green silicon carbide is suitable for processing hard alloy, metallic and non-metallic marterails with hard and brittle feature such as copper, brass, aluminium, magnesslum , jewel, optical glass, ceramics, etc.Super micropower of it is also a kind of ceramics material.
Advantage of 156x156mm 200um High efficiency P Type polysilicon wafer Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8%
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of high quality High efficiency P Type polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Advantage of 156x156mm 200um High efficiency silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3 minority carrier:>2 Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8%
top quality factory price 156x156mm 200um high quality High efficiency solar silicon wafers Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of High efficiency P Type solar silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of Hot Sales A Grade solar silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of 156x156mm 200um High efficiency silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8%
Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer ?The production process is simple, cost-effective, and reduces silicon waste ?High conversion efficiency, low fragmentation rate and low optical attenuation ?Manufacturing Specialization, Intelligence and Greening ?Customized products to meet customer
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3 minority carrier:>2 Hem width:157.00~157.25mm Thickness:200±20 m Transfer efficiency:>18.8% Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs
Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3©cm minority carrier :>6s Hem width:157.00~157.25mm Angle of Chamfer:1~2mm Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3©cm minority carrier :>6s Hem width:157.00~157.25mm Angle of Chamfer:1~2mm Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3©cm minority carrier :>6s Hem width:157.00~157.25mm Angle of Chamfer:1~2mm
Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
