Advantage of
156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Supplier: Remelted zinc ingots, pwg zinc ingots, zinc dross, zinc ash, zinc oxide, lead dross, magnesium ingots, all grades, silicon metal, lead ore/ concentrate, zinc concentrate/sulphide
Buyer: Zinc dross, zinc ash or skimming from hot dip galvanizing process, zinc fines, zinc die cast scraps, lead dross, brass and copper scraps