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Hot Sales A Grade Polysilicon Wafer

Supplier From China
Jun-27-19

Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20 m
Transfer efficiency:>18.8%
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs


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Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
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Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
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Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs

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Email contact US:wmsale@hxkjgf.com
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Technology : Diamond wire cutting
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minority carrier:>2 s
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Thickness:200±20m
Transfer efficiency:>18.8%
http://en.hengxingchinese.com/
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top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer
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High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Technology : Diamond wire cutting
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Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
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Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer ?The production process is simple, cost-effective, and reduces silicon waste ?High conversion efficiency, low fragmentation rate and low optical attenuation ?Manufacturing Specialization, Intelligence and Greening ?Customized products to meet customer
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Name: High efficiency
polycrystalline silicon block
Technology :Semi-melting
Type: P Type
Resistance:1~3©cm
minority carrier :>6s
Hem width:157.00~157.25mm
Angle of Chamfer:1~2mm
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%

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