IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards
IPC announces the release of five newly revised standards covering several areas of the supply chain.
IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies
IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2591-Version 1.1, Connected Factory Exchange (CFX)
IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards
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Details on some of the changes for the newly released standards:
IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training.
There are several new or revised graphics
The solderless wrap section was completely revised
A new section was added for over-molding of flexible flat ribbon
IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.
Several figures are updated
New sections and comments on microvia stacking
Back-drilled holes and dual row zero insertion force (ZIF) connectors updated
IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.
Provides new acceptance criteria for back drilled holes
Establishes new requirements for copper wrap plating of holes in new designs
Discusses reliability issues for microvia structures in class 3 products
IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.
provides changes made to message sections, and message structure sections
Appendix A was added with a short description of all changes from V1.0
Appendix B provides acronyms and abbreviations
IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.
New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations
Several sections have been updated from Scope through and including 3.0requirements
Classifications of Class I, 2 and 3 have been added
Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material Key specifications/special features: Number of layers: 2 to 4 Thickness: 12 mil only Thermal performance: 30% better conduction than standard 0.062-inch fr4 New fr4 technology from photo circuit New thermally conductive adhesive technology Suitable for body through power train controller application Standard export carton
2 layers rigid-flex pcb Minimum line width/space: 8mils Surface finish: immersion gold Board thickness: 0.50mm Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.10mm flexible pcb inside Carton
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