LAYER 4layer [FLEXIBLE 1layer + RIGID 3layer] 4-1
Application Industrial Equipment
Thickness 0.5T
Machine Drill Min. 0.25mm
Laser Drill BVH Min. 0.12mm
Cu Plating HOLE Min. 25
L/S 110/120
PSR / COV GREEN / YELLOW
Surface Treatment ENIG
Impedance LAYER 4L
Impeance spec 50
LAYER 4LAYER(FLEXIBLE 2L+RIGID 2L) 4-2-4-4
Application Industrial Equipment
Thickness RIGID part 0.6T
Structure 1-4L DRILL,1-2L,3-4L BLIND VIA
Machine Drill Min. 0.2mm /HOLEPLUG+ CAP PLATING
Laser Drill BVH Min. 0.1mm / PNL PLATING
Cu Plating Min. 25 / NORMAL PALTING
L/S 60/60
PSR GREEN
Surface treatment ELECTRO HARD GOLD + ENIG
LAYER FPCB 4 layer
Application MOTOR
Thickness FPCB 0.1T / MULTY 0.3T
L/S 50/50
Drill LASER DRILL 0.08mm
ANNULAR RING 42.5
Inspection spec Zero defect
SPECIAL item for controlling
Outer layer [14 layers ANNULAR RING ]
LAYER - Double side
Application For semiconductor inspection
Thickness - 0.07 T
Drill Min - 0.3 mm
Inspection spec - Zero defect
SPECIAL item for controlling - Hole tolerance [+-0.01]
SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6
Application Inspection equipment of Semiconductor
Thickness - 0.5T
Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH
Machine Drill Min. 0.25mm
Cu Plating VIA FILL + PTH
BGA(LAND/PITCH) - 0.3mm / 0.4pitch
PSR GREEN
Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4
Application Industrial Equipment
Thickness 1.2T
Structure 1-4L DRILL
Machine Drill Min. 0.25mm
Cu Plating Min. 25 / NORMAL PALTING
L/S 100 / 100
PSR GREEN
Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2
Application Industrial Equipment
Thickness 1.6T
Machine Drill Min. 0.25mm
Cu Plating HOLE Min. 20
L/S 400 / 100
PSR / COV BLUE / BLACK
Surface treatment ENIG
Impedance LAYER 1L
Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10
Application GPS
Thickness 1.6T
Machine Drill Min. 0.2mm
Laser Drill BVH Min. 0.1mm
Cu Plating HOLE Min. 25
L/S 100/100
PSR GREEN
Surface treatment ENEPIG, ENIG
Impedance LAYER 1L, 4L, 8L, 10L
Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M
Flatness & Tilt Special :30
Thickness 0.25T ~ 0.45T
Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA
Machine Drill Min. 0.15mm
Laser Drill BVH Min. 0.10mm
Cu Plating 18[+-3] / PTH or Via Fill
BGA PITCH 0.4mm Under
LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2]
PSR BLACK , BLUE , GREEN
Surface treatment ENEPIG
Stiffner PI , SUS
Other EMI
Impedance 100
LAYER FPCB S/S
Application Medical equipment
Thickness 0.06T
L/S 50/50
DRILL/LAND 200/400
Inspection spec Zero defect on circuit
SPECIAL item for controlling Stair-shape at inner circuit
LAYER 4Layer (FLEXIBLE 2L+RIGID 4L) 4-2-4-3-2
Application Blood Sugar Check
Thickness 0.38T
Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA
Machine Drill Min. 0.1mm
Laser Drill BVH Min. 0.1mmSTACK VIA FILL copper plating
Cu Plating INNER : VIA FILL / OUT : PTH Min.20+ VIA FILL
L/S 50 / 50 (SPECIAL)
PSR GREEN
Surface treatment ENIG
Stiffner PI (3Mil)
Impedance 100
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield.
JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
1. LAYER: FPCB S/S
2. Application: Medical equipment
3. Thickness : 0.06T
4. L/S: 50 micrometer /50 micrometer
5. DRILL/LAND: 200 micrometer /400 micrometer
6. Inspection spec: Zero defect on circuit
7. SPECIAL item for controlling :Stair-shape at inner circuit
Devotions on the Flex interconnection services for medical area are the core driving force as well as the main focus of Jinsung Electronics over the last 25 years. Jinsung Electronics produced flex and rigid-flex printed circuit boards that assisted physicians and healthcare professionals to offer more functions, operational easiness, and smaller size packages through innovation and collaboration with customers
1. Layer : FPCB S/S
2. Application : Medical Equipment
3. Thickness : 0.06T
4. L/S : 50 micrometer/50 micrometer
5. Laser cut treatment : +-50 micrometer
6. Inspection spec. : No defect on circuit / No defect on Silver plating / not allow damage by Laser cut
7. Special item for controlling :
1. Film coating and resolution
2. Will apply Scale for Laser and individual recognition
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V
and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
Jinsung Electronics produced flex and rigid-flex printed circuit boards that assisted physicians and healthcare professionals to offer more functions, operational easiness, and smaller size packages through innovation and collaboration with customers.
Jinsung Electronics founded in 1995 produces the main board RF/Flexible PCB which is the basis of the electronics
closely related to our daily lives.
To cope with the drastic changes of smartphones and mobile electronic devices, the company develops competitive RF and FPCB products.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
Jinsung Electronics produced flex and rigid-flex printed circuit boards that assisted physicians and healthcare professionals to offer more functions, operational easiness, and smaller size packages through innovation and collaboration with customers.
LAYER Double side FPCB + partial PSR + SUS + CBF
Application CCM
Thickness 0.3T
L/S 60/60
DRILL/LAND 200/350
Copper plating Inner Hole Min. 18
Inspection spec Zero defect in SUS and appearance
LAYER Double side FPCB + Partial PSR
Application SENSOR
Thickness CON. 0.2T
L/S 125/125
LASER Drill 50
Copper plating Hole inner Min. 25
Inspection spec Not allowing damage on copper plating part
SPECIAL item for controlling
Stair-shape at Copper plating neighboring area
Apply WET LAMINATION method
LAYER FPCB S/S
Application Medical equipment
Thickness 0.06T
L/S 50/50
LASER CUT tolerance +-50
Surface treatment SILVER
Inspection spec Zero defect
SPECIAL item for controlling
Film coating and resolution
Will apply scale for Laser individual recognition
Trends driving the car of the future are all enabled by more complex and intelligent electronics.
Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.
JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life.
For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield.
JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
Button Cu Plating manufacturing specification [FPCB D/S]
1. Layer : Double side FPCB + Partial PSR
2. Application : Sensor
3. Thickness : CON. 0.2 T
4. L/S : 125 micrometer/125 micrometer
5. Laser drill : 50 micrometer
6. Copper plating : Hole inner Min. 25 micrometer
7.Inspection spec :Not allowing damage on copper plating part
8. SPECIAL item for controlling :
- Stair-shape at Copper plating neighboring area
- Apply WET LAMINATION method
Jinsung Electronics is a company to lead manufacturing of Flex Printed Circuits and Rigid-Flex Printed Circuits with fast delivery and competitive price.
1. LAYER : 4 layer (FLEXIBLE 2 layer+RIGID 2 layer) 4-2-4
2. application : Industrial Equipment
3. Thickness : 1.2T
4. Structure : 1-4L DRILL
5. Machine Drill : Min. 0.25 mm
6. Cu Plating : Min. 25 micrometer / NORMAL PALTING
7. L/S : 100 micrometer / 100 micrometer
Smartphone RFPCB /Flexible PCB
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed.
1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10
2. Application : GPS
3. Thickness : 1.6T
4. Machine Drill : Min. 0.2 mm
5. Laser Drill : BVH Min. 0.1 mm
6. Cu Plating : HOLE Min. 25 micrometer
7. L/S : 100 micrometer / 100 micrometer
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1
2. Application : Industrial Equipment
3. Thickness : 0.5T
4. Machine Drill : Min. 0.25 mm
5. Laser Drill : BVH Min. 0.12 mm
6. Cu Plating : HOLE Min. 25 micrometer
7. L/S : 110 micrometer/ 120 micrometer
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market
1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6
2. Application : Inspection equipment of Semiconductor
3. Thickness : 0.5T
4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH
5. Machine Drill : Min. 0.25mm
6. Cu Plating : VIA FILL + PTH
7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
Unbalance Rigid Flexible (FPCB+FR4) Double Side manufacturing specification:
1. Layer : 2 layer [Flexible 1 layer + Rigid 1 layer] 2-1-2
2. Application : Industrial Equipment
3. Thickness : 1.6T
4. Machine drill : min. 0.25 mm
5. Cu plating : hole min. 20 micrometer
6. L/S : 400 micrometer / 100 micrometer
7. PSR / COV : blue / black
8. Surface treatment : ENIG
9. Impedence layer : 1 L
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
MOTOR manufacturing specification [FPCB MULTY]
1. Layer : FPCB 4 layer
2. Application : motor
3. Thickness : FPCB 0.1T / MULTY 0.3T
4. L/S : 50 micrometer/50 micrometer
5. Drill : LASER DRILL 0.08 mm
6. ANNULAR RING : 42.5 micrometer
7. SPECIAL item for controlling : Outer layer [14 layers ANNULAR RING ]
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
Competitive Advantages
Most advanced fpc/r-fpc fabrication techniques
Rigid-flex printed circuits with fast delivery and competitive price.
Iso 9001 quality management system
Rigid-flex pcb for multiple product groups
Trends driving the car of the future are all enabled by more complex and intelligent electronics. Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.