A modified cycloaliphatic amine intended for use as a room temperature curing agent for liquid epoxy resins special features of this curing agent include its low viscosity, light colour, good colour stability and high gloss.
Non-reactive Polyamide Resin (Adhesive Agent for Printing Ink, Hot-melting Adhesive Agent)
A solid type fatty polyamide resin synthesized by a polycondensation of mainly the dimerized fatty acid and the alkylenepolyamines.
The major applications is in the rotogravure printing inks .
(a). Good solubility into various conventional industrial solvents.
(b). Superior adhesion onto many kind of substrates.
(c). Good wetting( dispersion,)of the pigments and dyestuffs.
(d). Good resistance to water, oil and chemicals..
(e). Fast release of the solvent from the printed film..
(f). Smooth and hard film surface with high gloss.
(g). Smooth and hard film surface with high gloss, which is suitable for over-printings.
Modified cycloaliphatic amine intended for use as a room temperature curing agent for liquid epoxy resins special features of this curing agent include its low viscosity, light colour, good colour stability and high gloss.
Non-reactive Polyamide Resin:
Adhesive Agent for Printing Ink
Hot-melting Adhesive Agent
Hardener for Epoxy:
Reactive Polyamide Resin
Denaturalized Polyamine
Denaturalized Polyamine Additive
Solvent-diluted Polyamide Resin
Polyaminoamide type epoxy curing agent.
Mixtured resin of hardner with an epoxy resin maintain a rather longer pot-life, and provides its cured products with well balanced cured properties.
hardner is a therefore recommended to be employed for such applications as general adhesives and structural adhesives in construction works.
Low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, moderate pot life, good colour stability and high gloss films are required.
It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, moderate pot life, good colour stability and high gloss films are required.
A low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required.
A high viscosity, reactive polyamide resin designed for use with liquid epoxy resins to achieve cure at room temperature.
It is suitable for use in adhesives, civil engineerings, high solids anti-corrosive coatings for marine and maintenance coatings where excellent adhesion, good flexibility and toughness, good water and corrosion resistance are required.
A polyaminoamide curing agent for liquid epoxy resin to achieve slow cure at ambient temperarure. It has a high molecular weight and provide the cured products with high orders of flexibility
adhesion good chemical and water resistance. The major applications are for general adhesives civil engineering and construction.
A polyaminoamide curing agent for liquid epoxy resin to achieve fast cure at ambient temperarure. It has a high molecular weight and provide the cured products with high orders of flexibility adhesion good chemical and water resistance. The major applications ofare for general adhesives civil engineering and construction.
A low viscosity, modified aliphatic polyamines epoxy curing agent. It has been designed for use in solventless coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required.
A self-emulsifiable type epoxy curing agent The mixture with liquid type epoxy resin provides stable emulsion, and can be used for pollution-free coating containing no solvents in its system. Outstanding is penetrating power into absorbent concrete, steel plate and other inorganic substrates. Among them , it is a water dilutable, such application as concrete primer is most recommendable.
A self-emulsifiable type epoxy curing agent The mixture with liquid type epoxy resin provides stable emulsion, and can be used for pollution-free coating containing no solvents in its system. Outstanding is penetrating power into absorbent concrete, steel plate and other inorganic substrates. Among them , as it is a water dilutable, such application as concrete primer is most recommendable.
Modified Polyamines
KINGCURE X-2001 is a mannish type Epoxy Resin hardener. Based on aromatic amine
developed for low viscosity fast curing.
KINGCURE X-2001 can be used in all normal amine reactions . It is a slightly yellow
product and has only limited solubility in water.
The reactivity with epoxy resin is so high that no accelerator are required The cure takes
place at high atmospheric humidity at temperature down to 5and even under water.
Viscosity(mPas /25C) ,200 ~ 2,500.
Modified Polyamines
KINGCURE 367-KV is a modified aromatic polyamines type curing agent
for liquid epoxy resin.
Itis a medium viscosity and pot life, The surface hardness is more than
KINGCURE X-165A to the mixed resin .The major applications solventless
coatings and leveling floorings where excellent
flow, good adhesion and high gloss films are required.
Viscosity (mPas /25C ) 100 ~ 400 .
Modified Polyamines
KINGCURE 800-C is a mercaptan terminated liquid polymer which is imparts rapid-cure
characteristics to epoxy resins in combination with selected amines these systems are unique in
that they also provide rapid cure rates at low temperatures and thin film ,application in
construction adhesives(Bonding compounds)5min fast-setting adhesives.
Viscosity (mPa s/ 25C ) 10,000~20,000 .
Modified Polyamines
KINGCURE N-768 is a rapid room temperature curing agent for epoxide resins.
It is a stable
liquid activated amine of particular use for solvent-free coatings, floor patch repair
kids,fast-setting adhesives,cold weather patching compounds and as an accelerator
for other amine and polyamide cures
Viscosity (mPa s/ 25C ) 150 ~ 250 .
Modified Polyamines
KINGCURE B-311 is a low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent.
It has been designed for use in solvent-less coatings and leveling floorings where excellent flow,
good adhesion and high gloss films are required.
Viscosity (mPa s , 25C) 300 ~ 700.
Polyamide For Hot Melt
KINGMIDE H-140HP is a high molecular weight polyamide resin especially
designed for hot melt-adhesive use. It is easy to soluble in mixed organic solvent such
as toluene and alcohol type solvent. This resin has the characteristics of good
mechanical strength, good heat resistance and flexibility. It is suitable for use in
sealing and electric parts adhesive .
Viscosity (mPa�·s / 200C) 5,000 ~ 10,000.
Polyamide For Hot Melt
KINGMIDE H-170HV is a high molecular weight polyamide resin especially designed for
hot melt-adhesive use.
KINGMIDE H-170HV is easy to soluble in mixed organic solvent
suchas toluene and alcohol type solvent. This resin has the characteristics of high softening
point, and high molten viscosity so that it is suitable for applications where high heat resistance
and high adhesive strength and good toughness are particularly needed.
Viscosity (mPa s / 200 C) 3,000 ~ 7,000.
Polyamide For Hot Melt
T-558-N is a solid-type fatty polyamide resin especially designed for HOT-MELT
STRUCTUAL ADHESIVE uses. It has superior processing properties for its ready-to-apply nature
due to the lower molten viscosity. Optimum application temperature of T-558-N is in the
range of 180C~200C.
T-558-N shows excellent adhesion onto various types of plastics,
and steel, as well as onto many other surfaces, giving very tough bonding and sealing strength.
T-558-N may be applied either by hand or manually operated by hand-guns.
An automatic dispensing equipment with a nozzle or a wheel applicator may also be benefited.
Viscosity (mPa s/ 200C ) :500 ~ 800.
Polyamide For Hot Melt
KINGMIDE H-175SP is a high molecular weight polyamide resin especially designed for
hot melt-adhesive use. KINGMIDE H-175SP is easy to soluble in mixed organic solvent,
such as toluene and alcohol type solvent.
This resin has the characteristics of high softening point, and high molten viscosity
so that it is suitable for applications where high heat resistance and high
adhesive strength and good toughness.
Viscosity (mPa s / 232C) 3,000 ~ 6,000.
Polyaminoamide Resin
KINGMIDE 315-FC is a polyaminoamide curing agent for liquid epoxy resin to achieve
fast cure more than KINGMIDE 315 at ambient temperature.
It has a high molecular weight andm provide the cured products with high orders of flexibility,
adhesion, good chemical and water resistance.
The major applications of KIMGMIDE 315-FC are for general adhesives, civil
engineering and construction.
Viscosity (mPa S / 40C ) -12,000 ~ 18,000.
Polyaminoamide Resin
KINGMIDE 310 is a polyaminoamide curing agent for liquid epoxy resin to achieve fast
cure more than KINGMIDE 305 at ambient temperature.
It has a high molecular weight and provide the cured products with high orders of flexibility, adhesion,
good chemical and water resistance. The major applications of KIMGMIDE 310 are for general adhesives,
civil engineering and construction.
Viscosity (mPa S / 40C degree) - 30,000 ~ 50,000.
Polyaminoamide Resin
KINGMIDE 328-A is a Polyaminoamide type epoxy curing agent.
Mixtured resin of KINGMIDE 328-A with an epoxy resin maintain a rather longer pot-life,
and provides its cured products with well balanced cured properties.
KINGMIDE 328-A is a therefore recommended to be employed
for such applications as general adhesives and structural adhesives
in construction works.
Viscosity (mPa s /25C degree) - 10,000 ~ 20,000 .
Polyaminoamide Resin
KINGMIDE 384-S is a modified polyaminoamide epoxy adduct curing agent for liquid
epoxy resin to achieve fast cure at ambient temperarure.
It has a high molecular weight and provide the cured products with high orders of
flexibility, adhesion, good chemical and water resistance.
The major applications of KIMGMIDE 384-S are for general adhesives,
civil engineering and construction.
Solution type polyamide type epoxy curing agent
KINGMIDE 581-60 is a solvent type epoxy curing agent of modified polyaminoamide,
designed for such coating applications as tar-epoxy system and enamel type.
KINGMIDE 581-60 provides its cured film with high orders of curing properties and superior
anti-chemical resistance.
Solution type polyamide type epoxy curing agent
KINGMIDE 300-65 is a polyamide type epoxy curing agent synthesized by polymerized
fatty acid and polyamines.
The resin component of KINGMIDE 300-65 is designed for high molecule weight and it is
therefore semi-solid in its form at an ambient temperature. However, for easy handling
at an actual application works, KINGMIDE 300-65 is dissolved
in the manufacturing process before being released to the users.
KINGMIDE 300-65, when cured with an epoxy resin, provides its cured films with such high
orders desired at actual application field as good flexibility, simultaneously with good water
resistance and good alkali resistance.
KINGMIDE 300-65 is thus desired for heavy duty primer coatings application of anti
corrosion resistance.
Viscosity (Gardner Holdt/25C degree )- Z ~ Z6.
Solution type polyamide type epoxy curing agent
KINGMIDE 305-70 curing agent is a standard reactive polyamide intended for use in curing
of epoxy resin. KINGMIDE 305-70 is cut to 70 percent solids by weight in xylene/ isobutanol.
Whem cured with ac high molecule weight of epoxy resin.
It is provides cured films with such high orders desired at actual application field as good flexibility,
simultaneously with good water resistance and good alkali resistance.
KINGMIDE 305-70 is thus desired for heavy duty primer coatings application of anti
corrosion resistance. Viscosity ( Gardner Holdt/25C degree ) - W~ Z.
Solution type polyamide type epoxy curing agent
KINGMIDE 423-HPP is a reactive modified polyamide curing agent for epoxy resins.
KINGMIDE 423HPP is cut to 60 percent solids by weight in xylene/ isobutanol .
When cured with high molecule weight of epoxy resin.
It is provides cured films with such high orders desired at
actual application field as good flexibility, simultaneously with good water resistance and good
alkali resistance. Especially for heavy duty primer coatings application of anti corrosion
resistance.
Viscosity ( Gardner Holdt/25C degree ) - U~Y.
Polyaminoamide Resin
KINGMIDE 305 is a typical polyaminoamide type epoxy curing agent.
KINGMID 305 has large molecular weight, it thus provide the cured products
with an epoxy resin with high orders of flexibility and adhesive.
Viscosity (mPa s /40C degree)- 50,000 ~ 70,000 .
Polyamide For Hot Melt
KINGMIDE H-120 is a high molecular weight polyamide resin especially designed for hot
melt-adhesive use.
KINGMIDE H-120 is easy to soluble in mixed organic solvent , such as
toluene and alcohol type solvent. This resin has the characteristics of high softening point, and
high molten viscosity so that it is suitable for applications were high heat resistance and high
adhesive strength and good toughness are particularly needed.
Viscosity (mPa s / 200C degree) - 2,200 ~ 2,800 .
Hot melt for gravure printing ink
KINGMIDE 550 is a solid type fatty polyamide resin synthesized
by a polycondensation of mainly the dimerized fatty acid and the alkylenepolyamines.
The major applications of KINGMIDE 550 are in the rotogravure printing inks .
KINGMIDE 550 shows superior adhesion onto wide variety of surface so that it is highly useful
for rotogravure ink formulation .
Hot melt- fatty polyamide resin
KINGMIDE 549 is fatty polyamide resin especially designed for the flexographic printing ink uses.
It is easy to alcohol soluble and mixing organic solvent -
such as toluene and alcohol type solvent .
KINGMIDE 549 as used in a flexographic printing ink formulation.
Viscosity (Gardner-Holdt / 25C degree)- E ~ H.
Hot melt fatty polyamide resin
KINGMIDE 533 is fatty polyamide resin especially designed for the flexographic printing ink uses.
It is easy to alcohol soluble and mixing organic solvent -such as toluene and alcohol type solvent .
The followings are the major characteristics of the KINGMIDE 533 as used
in a flexographic printing ink formulation.
(a) good solubility into various conventional industrial solvents
(b) superior adhesion onto many kind of substrates
(c) high water resistance
(d) high gloss
A curing agent is a standard reactive polyamide intended for use in curing of epoxy resin .It is cut to 60 % solids by weight in xylene.
When cured with high molecule weight of epoxy resin .it is provides cured films with such
high orders desired at actual application field as good flexibility, simultaneously with good water resistance and good alkali resistance.
Thus desired for heavy duty primer coatings application of anti corrosion resistance.
Flooring-
a low viscosity, modified -aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required.
A high molecular weight polyamide resin especially designed for hot melt adhesive use.
It is easy to soluble in mixed organic solvent such as aliphatic or aromatic hydrocarbons and alcohols type solvent. This resin has the characteristics of good mechanical strength heat resistance, flexibility and long open times(good workability) .
Modified Polyamines
KINGCURE X-165A is a low viscosity, modified aliphatic polyamines epoxy curing agent.
It has been designed for use in solventless coatings and leveling floorings where excellent flow,
good adhesion and high gloss films are required.
Viscosity (mPa s /25C) : 50 ~ 150.
High molecular weight polyamide resin-hot melt
HT-45 is a high molecular weight polyamide resin especially
designed for hot melt adhesive use. It is easy to soluble in mixed organic
solvent , such as aliphatic or aromatic hydrocarbons and alcohols type solvent.
This resin has the characteristics of good mechanical strength, heat resistance, flexibility
and long open times(good workability).
This product is suitable for bonds to many difficult substrates including : PCB parts, metals, plastics, leather and fabric.
Viscosity (mPa s/ 200C degree)- 2,000 ~ 4,000
High molecular weight polyamide resin- hot melt
HT-65 high molecular weight polyamide resin especially designed for hot melt-adhesive use.
This resin has the characteristics of high softening point, and high molten viscosity so
that it is suitable for applications where high heat resistance, high creep strength, high adhesive
strength required and it is especially application for low pressure moulding.
Viscosity (mPas / 200C degree) - 2,000 ~ 5,000.
