Polyamide For Hot Melt T-558-N is a solid-type fatty polyamide resin especially designed for HOT-MELT STRUCTUAL ADHESIVE uses. It has superior processing properties for its ready-to-apply nature due to the lower molten viscosity. Optimum application temperature of T-558-N is in the range of 180C~200C. T-558-N shows excellent adhesion onto various types of plastics, and steel, as well as onto many other surfaces, giving very tough bonding and sealing strength. T-558-N may be applied either by hand or manually operated by hand-guns. An automatic dispensing equipment with a nozzle or a wheel applicator may also be benefited. Viscosity (mPa s/ 200C ) :500 ~ 800.