High molecular weight polyamide resin- hot melt HT-65 high molecular weight polyamide resin especially designed for hot melt-adhesive use. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance, high creep strength, high adhesive strength required and it is especially application for low pressure moulding. Viscosity (mPas / 200C degree) - 2,000 ~ 5,000.
