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Polyamide For Hot Melt

(1.0)
Supplier From Taiwan
Mar-18-23

Polyamide For Hot Melt

T-558-N is a solid-type fatty polyamide resin especially designed for HOT-MELT
STRUCTUAL ADHESIVE uses. It has superior processing properties for its ready-to-apply nature
due to the lower molten viscosity. Optimum application temperature of T-558-N is in the
range of 180C~200C.

T-558-N shows excellent adhesion onto various types of plastics,
and steel, as well as onto many other surfaces, giving very tough bonding and sealing strength.
T-558-N may be applied either by hand or manually operated by hand-guns.
An automatic dispensing equipment with a nozzle or a wheel applicator may also be benefited.

Viscosity (mPa s/ 200C ) :500 ~ 800.

Price and Minimum Quantity

Price: $3.0 - $6.0
MOQ: Not Specified
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