SECrosslink-6063 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process. Brand SECrosslink Type SECrosslink-6063 Product Low temperature curing type conductive silver adhesive Curing temperature 100 Adhesive types Epoxy Application Electronics and semiconductors Appearance Silver gray Density 4.5g/cm3 Content of effective elements 87% Volume resistivity 0.00005©cm Curing time 0.5h Shelf life 6 months