LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 DRILL/LAND 200/400 Inspection spec Zero defect on circuit SPECIAL item for controlling Stair-shape at inner circuit
Boiler, Digital Lobby Phone
Board MAIN, CONTRONIC PBA
Fashion jewelry, costume jewelry, fashion jewellery, costume jewellery, 925 silver jewelry, chains for costume jewelry, chains for handbag and apparel , parts for jewelry , bracelet, necklace, ring, and earrings..Production, packing , shipping, documentation, business communications, business trip, products catalog providing service
Anti-radiation products for cellphone, radiation shield, wave absorber, electromagnetic wave shield.
Stainless steel, carbon fiber, robot, valve..Import and export
Semiconductor parts and a wide range of aluminum products, including sheets, coils, and scrap..
- Material : Stainless Steel Core, Polyethylene Yarn, Span Yarn - Number of Stitiches : 10 Gauge - Length : 14 inch - Cut Level : 5 - Color : Gray, Black, White - Packing : 1pair/individual packing (1pack=5pair, 1box=200pair) - Origin : Made in South Korea - Purpose : Cut Resistant
Dear Sir/ Madam, We are a trader of Semiconductor Chips We handle various types of semiconductor chips and supply only 100% authorized products. If you are interested, please let us know the following information for your needing semiconductor chip. 1. Manufacturer 2. Part No 3. Quantity We hope to do business with your company.
Semiconductor : Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process Features of the product - Si Wafer Damage Relief design - Damage area minimizing design and Wheel design considering Ra - Guttering effect Wheel design
WCDMA PICO ICS repeater, RRH, tower mounted amplifier.
We supply multi-faceted semiconductor chips. 1. Flash Memory [NAND/NOR] 2. eMMC (Flash+Controller) 3. ddram (ddr5,4,3,2/lpddr5,4,3) 4. Module 5. SSD 6. HDD
Simultaneous connection of two terminals Transfer speed is faster than connecting one by one by reading and writing at the same time. Media data, P2P wireless transmission Large items such as photos, music, etc. can be transferred from phone to phone separately after separation from PC. More diverse transmission items It supports a variety of transfer items on your smartphone.
Experience faster transfer speeds with simultaneous connections to two terminals, allowing for quicker reading and writing processes. This system enables peer-to-peer (P2P) wireless transmission of media data, facilitating the transfer of large items such as photos and music between phones, especially after separation from a PC. Additionally, it supports a wide variety of transfer items on smartphones.
Faster transmission speeds are possible with simultaneous connections to two terminals, allowing for faster reading and writing processes. This technology enables peer-to-peer (P2P) wireless media data transmission, simplifying the transfer of big things such as images and music between phones, particularly after being disconnected from a PC. Furthermore, it supports a broad range of smartphone transfer goods.
