Product Name : DECO Design RINGKE DECO Material : PET / FABRIC /PAPER Package : A. Eco Package (120 x 210 mm)
Product Name : Ringke Fusion for Galaxy J7 2016 Options : Crystal View, Smoke Black Material : PC + TPU (Temperature Polyurethane) Package : A. Eco Package (120 X 210 Mm) B. Retail Package (98 X 182 X 17mm)
KEC -1A Coin Count and Dispenser made of rugged Metal Housing High Speed, High Quality, High Satisfaction! The KEC-1A Coin Counter/Dispenser is a high quality, high speed machine capable of dispensing and counting large volumes with ease. Fast, quiet and accurate, the KEC-1A Dispenser comes with a separate Customer Verification display and its own Remote Keypad features all at an extremely affordable price. Designed for coin clearance and cashiering. The software is extremely user friendly. Manufactured specifications: *Rugged metal housing, compact CE qualified construction *Comes complete with remote keypad and a customer Display(verification meter) *Stainless Steel Hopper built to last the distance *Large 3,500 coin Hopper capacity *Functional robust design at a very affordable cost *Hi-tech electronic sensing for accurate counting *Automatic coin feeding by built-in conveyor system *Can preselect batch amounts up to 9,999 *Low noise design for quiet, smooth dispensing *Easy one-touch release button for removing jammed coins or foreign objects *LCD operators display *Weight: 27 Kg *Size: W 255mm D 570mm H 365mm *Weight: 27 Kg *Size: W 255mm D 570mm H 365mm
LAYER - Double side Application For semiconductor inspection Thickness - 0.07 T Drill Min - 0.3 mm Inspection spec - Zero defect SPECIAL item for controlling - Hole tolerance [+-0.01] SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 DRILL/LAND 200/400 Inspection spec Zero defect on circuit SPECIAL item for controlling Stair-shape at inner circuit
Boiler, Digital Lobby Phone
Board MAIN, CONTRONIC PBA
Fashion jewelry, costume jewelry, fashion jewellery, costume jewellery, 925 silver jewelry, chains for costume jewelry, chains for handbag and apparel , parts for jewelry , bracelet, necklace, ring, and earrings..Production, packing , shipping, documentation, business communications, business trip, products catalog providing service
Anti-radiation products for cellphone, radiation shield, wave absorber, electromagnetic wave shield.
Stainless steel, carbon fiber, robot, valve..Import and export
Semiconductor parts and a wide range of aluminum products, including sheets, coils, and scrap..
Dear Sir/ Madam, We are a trader of Semiconductor Chips We handle various types of semiconductor chips and supply only 100% authorized products. If you are interested, please let us know the following information for your needing semiconductor chip. 1. Manufacturer 2. Part No 3. Quantity We hope to do business with your company.
Semiconductor : Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process Features of the product - Si Wafer Damage Relief design - Damage area minimizing design and Wheel design considering Ra - Guttering effect Wheel design
WCDMA PICO ICS repeater, RRH, tower mounted amplifier.
We supply multi-faceted semiconductor chips. 1. Flash Memory [NAND/NOR] 2. eMMC (Flash+Controller) 3. ddram (ddr5,4,3,2/lpddr5,4,3) 4. Module 5. SSD 6. HDD
