Specifications: Base material: FR4 Layers coverage: two Board thickness: 1.6mm Copper thickness: 4oz Surface treatment: immersion gold Payment details: Payment terms: Telegraphic transfer (TT, T/T) Minimum order: 1 to 99 pieces. Base on customer's request.
Key specifications/special features: Base material: fr4 Layer coverage: 2 layers Board thickness: 2.0mm Copper thickness: 2oz Surface treatment: lead-free hasl Solder mask color: blue Payment details: Payment terms: Telegraphic transfer (TT, T/T) Minimum order: 1 to 99 pieces. Base on customer's request
Key specifications/special features: Base material: fr4 Layer coverage: 2 layers Board thickness: 1.2mm Copper thickness: 1oz Surface treatment: immersion gold Line space/width: 0.15mm/0.15mm (minimum) Hole size: 0.4mm (minimum) Soldermask color: orange Payment details: Payment terms: Telegraphic transfer (TT, T/T) Minimum order: 1 to 99 pieces. Base on customer's request
Products ranges from single layer to 14 layers boards (rigid, aluminum, HDI, rogers, taconic) with a wide range of surface finish, such as OSP, HAL, HAL lead free, immersion gold, immersion silver, flash gold and immersion tin, etc.
Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with High frequency material PCB, including Rogers and Taconic. Main parameters: 1) Woven Glass-Reinforced PTFE 2) Available material: RO4350B 4mil(0.1mm) 10mil(0.254mm) 13.3mil(0.338mm) 20mil (0.508mm) 30mil(0.762mm) 60mil(1.524mm) RO4003C 12mil(0.3mm) 20mil(0.508mm) 32mil(0.813mm) 60mil(1.524mm) F4BK www.wang-ling.com.cn Taconic 20mil(0.5mm) 30mil(0.762mm) 40mil(1.0mm) ER 2.55 3) NPTH and PTH 4) Together with FR-4 combination 5) Application: Power divider, Combiner, Coupler, Power amplifier, Trunk amplifier, Station and 3G antenna. Vaccume bags.
Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with quick turn prototypes. Main parameters: 1). Material: FR-4, High Tg FR-4 2). Layer count: 2 -16 Layer, 20 m PTH 3). Thickness: 0.5-1.6mm +/- 10% 4). Copper weight(Finished): 18-35 m 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.3mm minimum, 4/4 mil track/space 7). Pads finish: HASL, HASL Pb 8). Delivery time (calendar day) 2 Layer -- 1 days 4 Layer -- 3 days 6 Layer -- 5 days 8 Layer -- 5 days 10 Layer -- 7 days 12 Layer -- 10 days 14 Layer -- 12 days 16 Layer -- 12 days. Packing: vacuum bag and carton box outside. Max. 25kg/ctn.
1) SMT solder paste stencil 2) 12" x 12" to 28" x 28" 3) With /without aluminium frame 4) 100% Laser cut (Chemical etch is optional) 5) Stencil thickness 0.05mm-0.2mm 6) Fiducal mark backside half-etch Vaccum bags.
Bicheng provides RD, high-tech, IT research companies and organizations, large and small with PCB prototypes. It covers: 1) 1-32 Layers, 0.3-6mm thick, Heavy copper (2-10 oz) 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn delivery 10) MOQ: 1 PCS. Packing: Vacuum bag and carton box outside Max. 25kg/ctn.
Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's. It covers: 1) 4-32 Layers, 0.5-6mm thick 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn prototype 10) Small and volume production. Vaccum bags.
PCB copy, PCB changing, schematic diagram designing, PCB layout, BOM list making, prototype manufacturing (including debugging), the batch processing of finished product, technical support, quality assurance of PCB production, according to the requirements of our customers.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
1. Touch switch 2. Chramatic light 3. With flip fuction 4. LCD screen.
1. Touch switch 2. With self-locking function 3. LCD screen.
1. Touch switch 2. With spark linkage function 3. LCD screen.
1. Touch switch 2. Three speed 3. Smoke detection system 4. With remote control 5. LCD screen.
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au: min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au: min. Gold fingers/Au:30u Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/ODM.
Layers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/space: 8/5.9 miles, Thickness: Rigid board: 2.00mm, Flex board: 0.24mm Size: 397.89 x 555mm.
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
