Find Verified Pcb Suppliers, Manufacturers and Wholesalers

Key specifications/special features:
Base material: fr-4
Minimum board thickness: 0.15 to 0.3mm
Copper thickness: 1oz
Surface treatment: immersion gold

Payment details:
Payment terms:
Telegraphic transfer (tt, t/t)
Minimum order:
1 to 99 pieces.


Minimum order: 1 to 99 pieces.

Key specifications/special features:
Specifications:
Base material: aluminum-base
Layer coverage: single sided
Board thickness: 1.6mm
Copper thickness: 1oz
Surface treatment: hasl
Solder mask color: white
Application: led lighting products

Payment details:
Payment terms:
Telegraphic transfer (TT, T/T)
Minimum order:
1 to 99 pieces.


Base on customer's request.

Specifications:
Base material: FR4
Layers coverage: two
Board thickness: 1.6mm
Copper thickness: 4oz
Surface treatment: immersion gold

Payment details:
Payment terms:
Telegraphic transfer (TT, T/T)
Minimum order:
1 to 99 pieces.


Base on customer's request.

Key specifications/special features:
Base material: fr4
Layer coverage: 2 layers
Board thickness: 2.0mm
Copper thickness: 2oz
Surface treatment: lead-free hasl
Solder mask color: blue

Payment details:
Payment terms:
Telegraphic transfer (TT, T/T)
Minimum order:
1 to 99 pieces.


Base on customer's request

Key specifications/special features:
Base material: fr4
Layer coverage: 2 layers
Board thickness: 1.2mm
Copper thickness: 1oz
Surface treatment: immersion gold
Line space/width: 0.15mm/0.15mm (minimum)
Hole size: 0.4mm (minimum)
Soldermask color: orange

Payment details:
Payment terms:
Telegraphic transfer (TT, T/T)
Minimum order:
1 to 99 pieces.


Base on customer's request

Products ranges from single layer to 14 layers boards (rigid, aluminum, HDI, rogers, taconic) with a wide range of surface finish, such as OSP, HAL, HAL lead free, immersion gold, immersion silver, flash gold and immersion tin, etc.

Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with High frequency material PCB, including Rogers and Taconic.

Main parameters:
1) Woven Glass-Reinforced PTFE
2) Available material:
RO4350B
4mil(0.1mm)
10mil(0.254mm)
13.3mil(0.338mm)
20mil (0.508mm)
30mil(0.762mm)
60mil(1.524mm)
RO4003C
12mil(0.3mm)
20mil(0.508mm)
32mil(0.813mm)
60mil(1.524mm)

F4BK
www.wang-ling.com.cn

Taconic
20mil(0.5mm)
30mil(0.762mm)
40mil(1.0mm)
ER 2.55

3) NPTH and PTH
4) Together with FR-4 combination
5) Application: Power divider, Combiner, Coupler, Power amplifier, Trunk amplifier, Station and 3G antenna.




Vaccume bags.

Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with quick turn prototypes.

Main parameters:
1). Material: FR-4, High Tg FR-4
2). Layer count: 2 -16 Layer, 20 m PTH
3). Thickness: 0.5-1.6mm +/- 10%
4). Copper weight(Finished): 18-35 m
5). SMOBC: LPI Green solder mask/ White legend
6). Holes: 0.3mm minimum, 4/4 mil track/space
7). Pads finish: HASL, HASL Pb
8). Delivery time (calendar day)
2 Layer -- 1 days
4 Layer -- 3 days
6 Layer -- 5 days
8 Layer -- 5 days
10 Layer -- 7 days
12 Layer -- 10 days
14 Layer -- 12 days
16 Layer -- 12 days.


Packing: vacuum bag and carton box outside.
Max. 25kg/ctn.

1) SMT solder paste stencil
2) 12" x 12" to 28" x 28"
3) With /without aluminium frame
4) 100% Laser cut (Chemical etch is optional)
5) Stencil thickness 0.05mm-0.2mm
6) Fiducal mark backside half-etch


Vaccum bags.

Bicheng provides RD, high-tech, IT research companies and organizations, large and small with PCB prototypes.

It covers:
1) 1-32 Layers, 0.3-6mm thick, Heavy copper (2-10 oz)
2) High Tg 170, High CTI 600V
3) Impedance control +/-10%
4) 1+C+1 HDI, Buried/blind vias
5) Half hole, Via in pad, countersink hole
6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask
7) Rogers and FR-4 combination PCB.
8) BGA, CSP, QFN
9) Quick turn delivery
10) MOQ: 1 PCS.






Packing:
Vacuum bag and carton box outside
Max. 25kg/ctn.

Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's.

It covers:
1) 4-32 Layers, 0.5-6mm thick
2) High Tg 170, High CTI 600V
3) Impedance control +/-10%
4) 1+C+1 HDI, Buried/blind vias
5) Half hole, Via in pad, countersink hole
6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask
7) Rogers and FR-4 combination PCB.
8) BGA, CSP, QFN
9) Quick turn prototype
10) Small and volume production.


Vaccum bags.

PCB copy, PCB changing, schematic diagram designing, PCB layout, BOM list making, prototype manufacturing (including debugging), the batch processing of finished product, technical support, quality assurance of PCB production, according to the requirements of our customers.

Special futures
Thickness: 1.6mm
Application: projector or projecting apparatus
Minimum trace size: 0.1mm
Minimum drill: 0.15mm
With blind and buried holes
Layers: 1 to 28
Board finished thicknesses: 0.2 to 7.0mm
Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B
Maximum finished board size: 580 x 900mm
Minimum hole size: 4mil (0.1mm)
Minimum trace width/space: 3.5/3.5mil
Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP
Copper thicknesses: 0.5 to 6oz
Solder mask colors: green, yellow, black, white, red and blue
Copper thickness in hole: >18um
Inner packaging: plastic bag (vacuum packing)
Outline tolerance: ¡À0.13mm
Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm
With UL and TS16949:2002 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
Profiling: punching, routing, V-cut and beveling
OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided.

Inner:vacuum packaging.
Outer:carton.

1. Touch switch
2. Chramatic light
3. With flip fuction
4. LCD screen.

1. Touch switch
2. With self-locking function
3. LCD screen.

1. Touch switch
2. With spark linkage function
3. LCD screen.

1. Touch switch
2. Three speed
3. Smoke detection system
4. With remote control
5. LCD screen.

Specification: 6L
Material: FR-4 TG170
Board thickness: 1.6mm
Final copper: 35um
Solder mask color: Blue
Surface Finish: Immersion Gold, Au: min. Impedance control
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection.

Layer: 10L
Base Material:FR-4 tg180(ITEQ)
Board Thickness: 1.6mm
Final copper: 35um
Surface Finish:Immersion Gold/Au: min. Gold fingers/Au:30u
Solder mask: Green
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection.

Layer: 2 layer
Materials: PI
Copper Thickness: 35um
Min Board Thickness: 0.1mm
Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver
PI thickness: 1/2mil, 1 to 10 mil
ADH thickness: 1/2mil, 1mil
FPC, flexible PCB OEM/ODM.