IT supplies, networking, VPN solutions, surveillance systems, central communication systems, security & access control system, software, web, app development.
Electronic goods and sundry items.
Electronic goods.Inspection for goods in China
Semi-conductors and other electronic components that go into printed circuit boards.
Media video, electronics, security.Business contributors with europe and middle east
Ic , chip.
Telecom, consumer products.
Consumer electronic, wall mounts , telecommunication products.Aviation consultancy , it consultancy , training & hr services, oms
Electronics and telecommunications.
Optical communication products, optical fiber cables, optical transceiver modules, optical splitter adapter connectors, communication cables, power cables, power cable tool products, data communication equipment, video and audio transmission broadband multimedia equipment, computers and supporting equipment, power electronic products.
We offer a wide range of Power Semiconductor devices.
Heat Sink available in Exrtruded or Bonded, Material - 6063 Customize product as per customer drawing
We can supply different of AV Distribution as the follows: Converter;Extender;Martrix;Splitter;Switch.
LAYER - Double side Application For semiconductor inspection Thickness - 0.07 T Drill Min - 0.3 mm Inspection spec - Zero defect SPECIAL item for controlling - Hole tolerance [+-0.01] SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 DRILL/LAND 200/400 Inspection spec Zero defect on circuit SPECIAL item for controlling Stair-shape at inner circuit
