IT supplies, networking, VPN solutions, surveillance systems, central communication systems, security & access control system, software, web, app development.
Electronic goods and sundry items.
Electronic goods.Inspection for goods in China
Semi-conductors and other electronic components that go into printed circuit boards.
Media video, electronics, security.Business contributors with europe and middle east
Ic , chip.
Telecom, consumer products.
Consumer electronic, wall mounts , telecommunication products.Aviation consultancy , it consultancy , training & hr services, oms
Electronics and telecommunications.
We offer a wide range of Power Semiconductor devices.
Heat Sink available in Exrtruded or Bonded, Material - 6063 Customize product as per customer drawing
We can supply different of AV Distribution as the follows: Converter;Extender;Martrix;Splitter;Switch.
LAYER - Double side Application For semiconductor inspection Thickness - 0.07 T Drill Min - 0.3 mm Inspection spec - Zero defect SPECIAL item for controlling - Hole tolerance [+-0.01] SPECIAL item for controlling - Space between line [+-0.02]
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 DRILL/LAND 200/400 Inspection spec Zero defect on circuit SPECIAL item for controlling Stair-shape at inner circuit
Power Splitters, designed to evenly split high power cellular signals with minimal reflections or loss. 4 way splitter supporting 700 2700 MHz frequency band has low VSWR value. It is used to divide one feeder cable into two feeder cables.
