Thin Film Solar Cell Laser Scribing Machine

1.Introduction The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating. 2. Features Cnc worktable size: 900mm íß 1600mm High-speed up to 500 mm/s or 200 íß 4 Auto programming / cooling / on-off Kerfs width 0.05 ¿c 0.15 mm, continuously adjustable 3. Technical parameters Wavelength 532 nm Laser output stability ín ía 3% Beam expanded angle ín 8 mrad Scribing speed Continuously adjustable, max 250mm/s Kerf width Continuously adjustable, 0.05 - 0.15 mm Scribing area 900 mm íß 1600 mm Power supply Single-phase ac 220v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 1500w Cooling mode Air cooling 4.Standard configuration Laser machine íß 1 set Worktable unit (cnc controller) íß 1 set Pc íß 1 set Scribing software (in english) íß 1 set Operation manual (in english) íß 1. Wooden case

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1.Introduction The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system. 2. Features Excellent beam quality and system reliability High-speed scribing (up to 120 mm/s), very low-defective index Auto cooling system Precise CNC worktable Friendly man-machine interface and simple software operation 3. Technical Parameters Laser medium Nd3+:YAG Wavelength 1064 nm Pump source Kr lamp Laser cavity Ceramic Modulated frequency 0.5 - 50 kHz Beam power Adjustable, max 50 W Aiming laser Red Scribing speed Adjustable, max 120 mm/ s Scribing depth Max 1.2mm Line width Min 0.2mm Worktable repeating accuracy 0.01mm Marking area 300 mm í- 300 mm Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 5kW Dimension 550 mm x 290 mm x 650 mm Net weight ~560 kg Cooling Mode Water cooling 4.Standard Configuration Laser machine í- 1 set Exhauster í- 1 set Vacuum pump í- 1 set Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set Worktable unit (CNC controller) í- 1 set Kr lamp í- 2 pieces Laser detector í- 1 piece PC í- 1 set Scribing software (In English) í- 1 set Operation manual (In English) í- 1 Wooden Case

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For wafer scribing and dicing, you need the sharp edge of the UV laser Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing. Return visit UV laser scribing on the wafer, what's the customer's comment has recently welcomed a number of return visits from . Among them, has been ordering cooperation with for five years. He is the first batch of manufacturers to use UV lasers for wafer scribing. At that time, UV lasers were not widely used, and after tried to scribe the wafer surface, immediately chose to visit and witness the possibility of wafer scribing. Standing in the wave of laser technology, UV lasers win customers hearts with their strengths For him, the traditional process of scribing the wafer surface has insufficient precision, slow speed, and many consumables that have plagued him for a long time. During the visit of , he witnessed the spot emitted by the UV laser continuously moving on the tiny wafer. It only took more than ten seconds to complete the complex scribing, and it was able to automatically complete the scribing without the involvement of employees. conduct. 24 hours of stable continuous operation and super long life can also satisfy the assembly line of Moreover, in addition to the non contact processing of the material during operation, it only needs to be plugged in and no other auxiliary materials are needed to be lost, which greatly reduces the cost and waste. The 24 hour stable continuous operation and ultra-high life span can also satisfy the assembly line of Therefore, chose the ultraviolet laser at the beginning and has used it until now. Nanosecond UV Laser Every time there is a breakthrough in the research and development of UV lasers, understanding and congratulations. like many other customers, stands in the wave of laser technology, progresses and learns together with , and establishes a revolutionary friendship. Develop in different fields.

Supplier: Laser cutting and engraving machine, metal laser cutting machine, laser marking machine, solar cell test apparatus, solar module test apparatus, EL defect detector, laser scbing-film machine