Thin Film Solar Cell Laser Scribing Machine

1.Introduction
The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating.

2. Features
Cnc worktable size: 900mm íß 1600mm
High-speed up to 500 mm/s or 200 íß 4
Auto programming / cooling / on-off
Kerfs width 0.05 ¿c 0.15 mm, continuously adjustable
3. Technical parameters
Wavelength 532 nm
Laser output stability ín ía 3%
Beam expanded angle ín 8 mrad
Scribing speed Continuously adjustable, max 250mm/s
Kerf width Continuously adjustable, 0.05 - 0.15 mm
Scribing area 900 mm íß 1600 mm
Power supply Single-phase ac 220v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation)
Input power Max 1500w
Cooling mode Air cooling

4.Standard configuration
Laser machine íß 1 set
Worktable unit (cnc controller) íß 1 set
Pc íß 1 set
Scribing software (in english) íß 1 set
Operation manual (in english) íß 1.

Wooden case

The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.

Laser cutting (84561000)

1.Introduction
The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system.

2. Features
Excellent beam quality and system reliability
High-speed scribing (up to 120 mm/s), very low-defective index
Auto cooling system
Precise CNC worktable
Friendly man-machine interface and simple software operation

3. Technical Parameters
Laser medium Nd3+:YAG
Wavelength 1064 nm
Pump source Kr lamp
Laser cavity Ceramic
Modulated frequency 0.5 - 50 kHz
Beam power Adjustable, max 50 W
Aiming laser Red
Scribing speed Adjustable, max 120 mm/ s
Scribing depth Max 1.2mm
Line width Min 0.2mm
Worktable repeating accuracy 0.01mm
Marking area 300 mm í- 300 mm
Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation)
Input power Max 5kW
Dimension 550 mm x 290 mm x 650 mm
Net weight ~560 kg
Cooling Mode Water cooling

4.Standard Configuration
Laser machine í- 1 set
Exhauster í- 1 set
Vacuum pump í- 1 set
Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set
Worktable unit (CNC controller) í- 1 set
Kr lamp í- 2 pieces
Laser detector í- 1 piece
PC í- 1 set
Scribing software (In English) í- 1 set
Operation manual (In English) í- 1

Wooden Case

For wafer scribing and dicing, you need the sharp edge of the UV laser



Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.

Return visit UV laser scribing on the wafer, what's the customer's comment

has recently welcomed a number of return visits from . Among them, has been ordering cooperation with for five years. He is the first batch of manufacturers to use UV lasers for wafer scribing. At that time, UV lasers were not widely used, and after tried to scribe the wafer surface, immediately chose to visit and witness the possibility of wafer scribing.

Standing in the wave of laser technology, UV lasers win customers hearts with their strengths

For him, the traditional process of scribing the wafer surface has insufficient precision, slow speed, and many consumables that have plagued him for a long time. During the visit of , he witnessed the spot emitted by the UV laser continuously moving on the tiny wafer. It only took more than ten seconds to complete the complex scribing, and it was able to automatically complete the scribing without the involvement of employees. conduct.

24 hours of stable continuous operation and super long life can also satisfy the assembly line of

Moreover, in addition to the non contact processing of the material during operation, it only needs to be plugged in and no other auxiliary materials are needed to be lost, which greatly reduces the cost and waste. The 24 hour stable continuous operation and ultra-high life span can also satisfy the assembly line of Therefore, chose the ultraviolet laser at the beginning and has used it until now.

Nanosecond UV Laser

Every time there is a breakthrough in the research and development of UV lasers, understanding and congratulations. like many other customers, stands in the wave of laser technology, progresses and learns together with , and establishes a revolutionary friendship. Develop in different fields.

HDD-880 12.5 Full HD 1080P Display Capacitive Touch Screen POS System Machine with Optional MSR for Contactless Payment.

Model Number :
HDD-880
Samples:
HDD-880
$235.00/Piece | 1 Piece (Min. Order) | Buy Samples
Lead Time:
Quantity(Pieces) 1 - 10 11 - 100 >100
Est. Time(days) 7 20 To be negotiated
Customization:
Customized logo(Min. Order: 100 Pieces)
Customized packaging(Min. Order: 200 Pieces)
Graphic customization(Min. Order: 100 Pieces)