1.Introduction
The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system.
2. Features
Excellent beam quality and system reliability
High-speed scribing (up to 120 mm/s), very low-defective index
Auto cooling system
Precise CNC worktable
Friendly man-machine interface and simple software operation
3. Technical Parameters
Laser medium Nd3+:YAG
Wavelength 1064 nm
Pump source Kr lamp
Laser cavity Ceramic
Modulated frequency 0.5 - 50 kHz
Beam power Adjustable, max 50 W
Aiming laser Red
Scribing speed Adjustable, max 120 mm/ s
Scribing depth Max 1.2mm
Line width Min 0.2mm
Worktable repeating accuracy 0.01mm
Marking area 300 mm í- 300 mm
Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation)
Input power Max 5kW
Dimension 550 mm x 290 mm x 650 mm
Net weight ~560 kg
Cooling Mode Water cooling
4.Standard Configuration
Laser machine í- 1 set
Exhauster í- 1 set
Vacuum pump í- 1 set
Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set
Worktable unit (CNC controller) í- 1 set
Kr lamp í- 2 pieces
Laser detector í- 1 piece
PC í- 1 set
Scribing software (In English) í- 1 set
Operation manual (In English) í- 1
Wooden Case
1.Introduction The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating. 2. Features Cnc worktable size: 900mm íß 1600mm High-speed up to 500 mm/s or 200 íß 4 Auto programming / cooling / on-off Kerfs width 0.05 ¿c 0.15 mm, continuously adjustable 3. Technical parameters Wavelength 532 nm Laser output stability ín ía 3% Beam expanded angle ín 8 mrad Scribing speed Continuously adjustable, max 250mm/s Kerf width Continuously adjustable, 0.05 - 0.15 mm Scribing area 900 mm íß 1600 mm Power supply Single-phase ac 220v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 1500w Cooling mode Air cooling 4.Standard configuration Laser machine íß 1 set Worktable unit (cnc controller) íß 1 set Pc íß 1 set Scribing software (in english) íß 1 set Operation manual (in english) íß 1. Wooden case
1.Introduction The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating. 2. Features Laser: lamp-pumping laser Cnc worktable size: 500mm íß 500mm High-speed up to250 mm/s Auto programming / cooling / on-off Kerfs width 0.05-0.15 mm, continuously adjustable 3. Technical parameters Wavelength 532 nm Pump source Kr lamp Laser output stability ín ía 3% Beam expanded angle ín 8 mrad Scribing speed Continuously adjustable, max 250mm/s Kerf width Continuously adjustable, 0.05 ~ 0.15 mm Scribing area 500 mm íß 500 mm Power supply 3-phase 4-wire ac 380v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 5kw Cooling mode Water cooling 4.Standard configuration Laser machine íß 1 set Exhauster íß 1 set Vacuum pump íß 1 set Cooling unit (chiller, temperature controller, water tank, filter) íß 1 set Worktable unit (cnc controller) íß 1 set Kr lamp íß 2 pieces Laser detector íß 1 piece Wooden case
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
1.Introduction The new generation of laser marking machine YMM-50 is applicable to almost any material surface. It offers various advantages with comparison to the traditional marking methods, such as noise-free, stress-free, ink-free, hazard-free (Printing marking uses hazardous solvent handling and disposal), tools-free and wearing-free(Tools wear in stamping systems). Laser marking technique offers a quiet, clean, low maintenance and easily configured system for permanent marking of almost any material surface. 2. Features Friendly and ergonomical man-machine interface Stable, precise and high-speed system File format to support any CorelDraw format, e.g., PLT, BMP, DST, etc.; Embedded test and graphic design tools offer various editing features Auto-numbering Barcode marking including Code 39, 93, 128, EAN-8, EAN-13, VIN, etc. and serial numbers Auto cooling Flexible text / graphics marking; Line or arc scribing to enable flexible profile scribing (Complicated profile scribing is optional) 3. Technical Parameters Wavelength 1064 nm Pump source Kr lamp Laser cavity Ceramic Laser output stability í_ í+ 3% Beam expanded angle í_ 8 mrad Aiming laser Red Linear speed Adjustable, max 5000 mm/ s Line width Min 0.1mm Letter size Min 0.5mm Marking area F=160 mm 70 mm í- 70 mm F=220 mm 100 mm í- 100 mm F=250 mm 150 mm í-150 mm Power supply Single-phase AC 220 V í+ 10%, 50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 7kW Dimension 1500 mm x 500 mm x 1200 mm Net weight ~180 kg Cooling Mode Water cooling 4.Standard Configuration Laser machine í- 1 set PC í- 1 set Marking software (In English) í- 1 set Operation manual (In English) í- 1 Wooden Case
1.Introduction The laser marking machine YMM-10C is applicable to almost any non-metal surface. It has many clear advantages with comparison to traditional marking methods, such as noise-free, stress-free, ink-free, hazard-free (Printing marking uses hazardous solvent handling and disposal), tools-free and wearing-free (Tools wear in stamping systems). Laser marking offers a quiet, clean, low maintenance and easily configured system for permanent marking of almost any surface. 2. Features Unique optics design Friendly and ergonomical man-machine interface Stable, precise and high-speed File format to support any CorelDraw format, e.g., PLT, BMP, DST, etc.. Embedded test and graphic design tools offers various editing features Barcode marking including Code 39, 93, 128, EAN-8, EAN-13, VIN, Data Matrix, QR Code, etc. , and serial numbers 3. Technical Parameters Wavelength 1064 nm Aiming laser Red Linear speed Adjustable, max 5000 mm/ s Line width Min 0.2 mm Letter size Min 0.8 mm Marking area F=160 mm 70 mm í- 70 mm F=220 mm 100 mm í- 100 mm F=250 mm 150 mm í-150 mm Power supply Single-phase AC 220 V í+ 10%, 50 Hz / 60Hz Input power Max 210W Dimension 550 mm x 290 mm x 650 mm Net weight ~33.75 kg Cooling Mode Air cooling 4.Standard Configuration Laser machine í- 1 set PC í- 1 set Marking software (In English) í- 1 set Operation manual (In English) í- 1 Wooden Case
20W Fiber Laser standard export wooden case
Domestic Fiber laser/IPG Fiber laser 500W / 1000W / 2000W standard export wooden case
This technology is widely used in production of photoelectric coaxial devices.Besides,single beam laser welding machine is popularly used in production of horizontal dual in the devices and power supply devices,etc,like coupling positioning spot welding of fiber, shell cover seal welding, spot welding precision coupling of fiber optic isolator,etc. standard export wooden case
Features: 1 Excellent beam quality: HY-FM series of fiber laser marking machine beam quality than the traditional solid laser marking machine, as the base model (TEMOO) output, focusing spot diameter of 10um. The divergence angle is 1/4 of the semiconductor pump laser. Especially for precision, fine marking. 2 use of low cost: Electro-optical conversion efficiency of up to 30%, the machine consumes less than 500w, is a light-pumped solid-state laser marking machine 1/10, significant savings in energy consumption. 3 maintenance-free operation: The laser does not require any maintenance or adjustment or cleaning of the lens. 4 long life: The average working hours up to 100,000 hours. 5 processing speed: Processing speed is 2-3 times the traditional laser marking machine Technical Information: Model: HY-FM-5/10/20 Laser power: 5/10 / 20W Laser wavelength: 1064nm Power adjustment range; 10-100% Repetition frequency: 20-100KHz Output beam quality (M2); 1.4-1.8 Electro-optical conversion rate: 30% For the industry: electrical appliances, electronic communications, automobile and motorcycle accessories, precision metal, gift accessories, glasses watches and clocks, instrumentation and sanitary ware and other industries
