For wafer scribing and dicing, you need the sharp edge of the UV laser
Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.
Return visit UV laser scribing on the wafer, what's the customer's comment
has recently welcomed a number of return visits from . Among them, has been ordering cooperation with for five years. He is the first batch of manufacturers to use UV lasers for wafer scribing. At that time, UV lasers were not widely used, and after tried to scribe the wafer surface, immediately chose to visit and witness the possibility of wafer scribing.
Standing in the wave of laser technology, UV lasers win customers hearts with their strengths
For him, the traditional process of scribing the wafer surface has insufficient precision, slow speed, and many consumables that have plagued him for a long time. During the visit of , he witnessed the spot emitted by the UV laser continuously moving on the tiny wafer. It only took more than ten seconds to complete the complex scribing, and it was able to automatically complete the scribing without the involvement of employees. conduct.
24 hours of stable continuous operation and super long life can also satisfy the assembly line of
Moreover, in addition to the non contact processing of the material during operation, it only needs to be plugged in and no other auxiliary materials are needed to be lost, which greatly reduces the cost and waste. The 24 hour stable continuous operation and ultra-high life span can also satisfy the assembly line of Therefore, chose the ultraviolet laser at the beginning and has used it until now.
Nanosecond UV Laser
Every time there is a breakthrough in the research and development of UV lasers, understanding and congratulations. like many other customers, stands in the wave of laser technology, progresses and learns together with , and establishes a revolutionary friendship. Develop in different fields.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
Laser cutting (84561000)
1.Introduction The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system. 2. Features Excellent beam quality and system reliability High-speed scribing (up to 120 mm/s), very low-defective index Auto cooling system Precise CNC worktable Friendly man-machine interface and simple software operation 3. Technical Parameters Laser medium Nd3+:YAG Wavelength 1064 nm Pump source Kr lamp Laser cavity Ceramic Modulated frequency 0.5 - 50 kHz Beam power Adjustable, max 50 W Aiming laser Red Scribing speed Adjustable, max 120 mm/ s Scribing depth Max 1.2mm Line width Min 0.2mm Worktable repeating accuracy 0.01mm Marking area 300 mm í- 300 mm Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 5kW Dimension 550 mm x 290 mm x 650 mm Net weight ~560 kg Cooling Mode Water cooling 4.Standard Configuration Laser machine í- 1 set Exhauster í- 1 set Vacuum pump í- 1 set Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set Worktable unit (CNC controller) í- 1 set Kr lamp í- 2 pieces Laser detector í- 1 piece PC í- 1 set Scribing software (In English) í- 1 set Operation manual (In English) í- 1 Wooden Case
1.Introduction The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating. 2. Features Cnc worktable size: 900mm íß 1600mm High-speed up to 500 mm/s or 200 íß 4 Auto programming / cooling / on-off Kerfs width 0.05 ¿c 0.15 mm, continuously adjustable 3. Technical parameters Wavelength 532 nm Laser output stability ín ía 3% Beam expanded angle ín 8 mrad Scribing speed Continuously adjustable, max 250mm/s Kerf width Continuously adjustable, 0.05 - 0.15 mm Scribing area 900 mm íß 1600 mm Power supply Single-phase ac 220v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 1500w Cooling mode Air cooling 4.Standard configuration Laser machine íß 1 set Worktable unit (cnc controller) íß 1 set Pc íß 1 set Scribing software (in english) íß 1 set Operation manual (in english) íß 1. Wooden case
1.Introduction The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating. 2. Features Laser: lamp-pumping laser Cnc worktable size: 500mm íß 500mm High-speed up to250 mm/s Auto programming / cooling / on-off Kerfs width 0.05-0.15 mm, continuously adjustable 3. Technical parameters Wavelength 532 nm Pump source Kr lamp Laser output stability ín ía 3% Beam expanded angle ín 8 mrad Scribing speed Continuously adjustable, max 250mm/s Kerf width Continuously adjustable, 0.05 ~ 0.15 mm Scribing area 500 mm íß 500 mm Power supply 3-phase 4-wire ac 380v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 5kw Cooling mode Water cooling 4.Standard configuration Laser machine íß 1 set Exhauster íß 1 set Vacuum pump íß 1 set Cooling unit (chiller, temperature controller, water tank, filter) íß 1 set Worktable unit (cnc controller) íß 1 set Kr lamp íß 2 pieces Laser detector íß 1 piece Wooden case
UV Laser Marking Machine Type: FST-3w/5w/8w Power: 3w/5w/8w Laser wavelength: 355 Marking area: 150mm*150mm Power input: 220V / 50HZ / single phase or 110V / 60HZ / single phase Power requirement:
Uv laser marking machine TypeKu1table, ku2 universal, ku3 rotary table Laser type/wavelength 355nm Laser power 1.5w3w5w10w Beam quality m24h+/-3% rms Peak power 125|¨¬j/10kw Marking size 100mm x 100mm 180mm x 180mm or order Marking depth Adjustable Marking speed 15000mm/s Marking width min 0.01mm(10|¨¬m) Marking character min 0.1mm Power total 700w Working temp. 10 - 30 Power supply Ac 220v/50hz Outsize 570*840*1240mm(difference by types) Advantages: 1.Fully air cooling system; 2.Stable performance, low maintenance in 100, 000hours; 3.All kinds of metal materials and some non-metallic material marking, can be used for the depth of the moment, the applicability is very widely; 4.Control by computer, can freely change the marking and parameters; 5.Small laser spot, fine, unique and never wear marking effect. Applications: 1.Areas with depth, smoothness and fine requirements; 2.Mobile phone keypad, plastic translucent keypad; 3.Electronic components, integrated circuits (ic), pcb; 4.Electrical appliances, communication products, signs; 5.Sanitary ware, hardware products; 6.Tool accessories, precision instruments panels; 7.Pvc pipe, medical equipment. Wooden boxes
Usage Precision cutting of fpc and organic membranes covering the board without the use of moulds or a protective plate. H, steep sidewall. Fixed sample vacuum mode without using a matrix protection plate, convenient and efficient. Used for a variety of substrate materials, such as: silicon, ceramics and glass. Automatic correction, positioning and multi-board cutting functions. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
Description- The UV Laser Marking with its wavelength 355nm is suitable for marking plastics (ABS, PA) due to a high repetition rate. The UV laser wavelength is suitable and versatile in marking a wide range of materials and is perfect for â??cold markingâ?? applications where heat zones are not allowed. UV Laser mark at very high speeds which are indispensable for short cycle times in industrial manufacturing environments. With high peak powers they are most suitable for fine marking and structuring without thermal impact on glass applications and/or ceramics. The UV laser marking will mark plastics and silicon materials without the need of additives and will also mark glass with drastically reduced risk of micro fracture. The excellent beam quality also affords this laser the ability to be utilized in micro marking applications such as electronics, circuit boards and microchips in addition to solar panels and precise medical marking applications. They also provide an excellent quality for classical laser marking applications and micro material processing. Features- Small beam diameter and fine marking line Good quality and high laser beam stability Complete machine stability, simple and easy operation Narrow pulse width, small heat affected zone, work-piece without damage Suitable for sensitive material as cold light source Laser directly acting on molecular chain with maximum extend to avoid thermal effect It works stably, applied in superbly precise marking, such as: LCD, wafer, chip ceramic, sapphire, precise surface marking of other materials,3C electronics, Lamps, food package, wire rod ,leather, ceramic, PCV, glass, Phone case, medicine bottle, fine marking on glass substrate, electric appliance marking and so on. Technical Specifications- Wavelength 335nm Laser Beam Mode TEM00 Average Power Up to 2W Positioning Visible Red Diode Light Input Power 115/230VAC 50/60Hz System Power Consumption < 950W Cooling Air Cooled, active thermo-electric/Water Cooled Operating Temperature Range 18 to 35C (64 to 95F) Humidity 10% to 85% Non-condensing STANDARD LENS CONFIGURATIONS FOCAL LENGTH 100 mm 65 mm X 65 mm (2.56 X 2.56) 160 mm 110 mm X 110 mm (4.33 X 4.33) 255 mm 175 mm X 175 mm (6.89 X 6.89)
