BeO ceramic materials.BeO has high thermal conductivity, high melting point (2530 ± 10°C), high strength, high insulation, high chemical and thermal stability, low dielectric constant, low dielectric loss and good adaptability properties,etc.Widely used in special metallurgy,vacuum electronics,nuclear technology,microelectronics and optoelectronics. Especially in high-power semiconductor devices,integrated circuits, package microwave vacuum devices and nuclear reactors.
Beryllium oxide (BeO), also known as beryllia, is an amorphous solid. Its high melting point leads to its use as a refractory material. Sintered beryllium oxide is a very stable ceramic.
BeO-ceramic has a high range of thermal conductivity between 300 500 W/(m.k), the highest among all ceramic materials used in electronic technology. It is used in many high-performance semiconductor parts for applications such as radio equipment ,a filler in some thermal interface materials such as thermal grease, a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers,etc...
Features
1. High thermal conductivity
2. High melting point
3. Excellent insulation
4. Low dielectric constant
5. Coating Layer: Molybdenum-Manganese(Mo/Mn)
T: 8~30m
Plated Layer: Nickel(Ni), Copper(Cu), Gold(Au), Etc.
T: 2~9m
6. Excellent thermal shock resistance
HTCC/LTCC High /Low Temperature Co-fired Ceramic material.Co-fired ceramic devices are fabricated using a multi-layer approach. The starting material is composite green tapes, consisting of ceramic particles mixed with polymer binders. The tapes are flexible and canbe machined, for example using cutting, milling, punching and embossing. Multilayers based on Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and Micro systems.With its ability to become three-dimensional structure.It is possible to integrate electrical circuits, to build up mechanical, fluidic or optical based sensory solutions and to realize ceramic packages for Sibased Logic or MEMS.
Alumina Ceramic
Alumina ceramic is kind of structural ceramics, with insulation resistance, voltage resistance, high strength, good thermal conductivity, dielectric loss, stable electrical performance characteristics. Used in electronic ceramic substrates, ceramic electrical insulation, vacuum devices, devices porcelain, spark plugs and other products. We can make the part by hot injection pressing, dry pressing, 200T isostatic pressing and extrusion productive technology etc.
Properties of Alumina/Aluminum Oxide (Al2O3)
Very good electrical insulation (1x1014 to 1x1015 �©cm)
Moderate to extremely high mechanical strength (300 to 630 MPa)
Very high compressive strength (2,000 to 4,000 MPa)
High hardness (15 to 19 GPa)
Moderate thermal conductivity (20 to 30 W/mK)
High corrosion and wear resistance
Good gliding properties
Low density (3.75 to 3.95 g/cm3)
Operating temperature without mechanical load 1,000 to 1,500°C.
Advantages Application
Excellent mechanical strength Power semiconductor modules
Excellent electrical insulation Concentrator Photovoltaic Arrays (CPV)solar arrays
High thermal stability solid-state relays
High thermal conductivity High frequncy switch mode power supplies(SMPS)
The thermal expansion coefficient is close to that of silicon Electronic heating devices
may be structured just like printed circuit boards Automobile electronics
Power LED module
Electronic heating devices
DBC substrate are composed of a ceramic
insulator,Al2O3 or AIN onto which pure copper
metal is attached by a high temperature eutectic
melting process and thus tightly and firmly joined to the ceramic,
DBC substrates have high
thermal conductivity,excellent electrical
insulation,excellent current carrying capability,
and good mechanical strength,and the thermal
expansion coefficient is close to that of silicon
etc.As a new and high capability substrate.DBC
substrates have been used widely in electric
power and electronic industry.
Silicon Nitride (Si3N4) has good high temperature strength, creep resistance and oxidation resistance.
In addition, its low thermal expansion coefficient gives good thermal shock resistance compared with most ceramic materials. Silicon nitride is produced in two main ways; Reaction bonded silicon nitride (RBSN), and hot pressed silicon nitride (HPSN) and sintered silicon nitride (SSN). RBSN is made by direct reacting compacted silicon powder with nitrogen, and produces a relatively low-density product compared with hot pressed and sintered silicon nitride, however the process has only a small volume change allowing net shape forming. The HPSN and SSN material is made with sintering aids and offers better physical properties suitable for more demanding applications.
Typical Silicon Nitride applications include:
Bearing balls and rollers
Cutting tools
Valves, turbocharger rotors for engines
Turbine blades
Glow plugs
Molten metal handling
Thermocouple sheaths
Welding jigs and fixtures
Welding nozzles
Advantages
1.High hardness
2.Wear resistance
3.High fire resistance
4.Corrosion preventive
5.Good chemical stability
Aluminum Nitride (AlN) ceramics and components,High thermal conductivity (theoretic value 280W/m.K),high electric resistance,low coefficient of heat expansion(4.5X10-6) good march with Si(3.5~410-6) and GaAs(610-6),Excellent electrical properties(Dielectric constant, dielectric loss, bulk resistivity, dielectric strength). features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. This makes aluminum nitride predestined for use in power and microelectronics applications. For example, it is used as a circuit carrier(substrate) in semiconductors or as a heat-sink in LED lighting technology or high-power electronics and renewable energy.
AlN ceramic has following properties
1) High thermal conductivity ( 280W/m.K)
(2) High electrical insulation capacity (>1.1012©cm)
(3) Low thermal expansion (coefficient of heat expansion)(4.5X10-6)Good with Si(3.5~410-6) and GaAs(610-6)
(4)Excellent electricity properties(Dielectric constant, dielectric loss, bulk resistivity, dielectric strength).
(5) Good mechanic properties
(6) Excellent corrosion resistance
(7) Good optical transmission property
Application
Power Module
Duo to its high thermal conductivity, high electricity resistance, excellent electricity properties Dielectric constant, dielectric loss, bulk resistivity, dielectric strengthAlN ceramics are widely applied to large scale IC package, silicon controlled rectifier,high speed conversion module,audio frequency and microwave power amplifier, photo-electron IC module, IGBT module, etc.
LED Package
AlN ceramics will replace traditional materials for high power LED substrates, becoming a preferred material for substrate.
High Brightness LED (HBLED):
UVLED (UVA, UVC):
RF/Microwave communication
Automotive Electronics
Image Sensing
BeO ceramic materials. BeO has high thermal conductivity, high melting point (2530 ± 10°C), high strength, high insulation, high chemical and thermal stability, low dielectric constant, low dielectric loss and good adaptability properties,etc.Widely used in special metallurgy,vacuum electronics,nuclear technology,microelectronics and optoelectronics. Especially in high-power semiconductor devices,integrated circuits, package microwave vacuum devices and nuclear reactors,
Beryllium Oxide ceramic material specification and properties
Beryllium oxide property
Melting point 2575°C
Boiling point 4300 ° C
Density 3.01 g/mL at 25 °C (lit.)
Refractive index 1.733
Flash point :4300 ° C
Form: Powder
Specific gravity: 3.01
Color :white
Insoluble in water: Slowly soluble in concentrated acids, alkali hydroxides
Merck 14,1172
Stability: Stable.
Get the following benefits from Coraynic beryllium in your application or design:
Lighter weight and higher thermal conductivity than aluminum
Stronger than steel
Performs reliably in cryogenic environments
High heat tolerance
Non-magnetic
High neutron reflectivity & low neutron absorption
Beryllium brings unrivaled advantages to its end-use applications, including:
Thermal conductivity that is better than aluminum
Moderate CTE & good natural damping - reducing jitter and vibrations
Low neutron absorption & high reflectivity
High specific heat & high thermal conductivity
Higher Modulus as the temperature decreases
High infrared reflectance
Low density
