Beryllium Oxide Ceramic Products

Alumina Oxide ceramic balls may be used at temperatures up to 3180 'F. Ceramic balls are extremely hard, resistant to abrasion, and immune to all furnace atmospheres. Applications, where alumina oxide balls are used, include chemical pumps, down-hole pumps, valves, bearings, gauges, flowmeters, etc.

Supplier: Zinc oxide, ceramics
Buyer: Zinc bars, zinc dross

Aluminum Nitrides (AlN) combine high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications.  Advantages High thermal conductivity.Thermal stability up to at least 1800°C Excellent insulation High hardness High compressive strength High accuracy Good wear-resistance Well resistant to high temperature Non-absorbent Favorable mechanical characteristics extending into the high-temperature range. Low thermal expansion and resistance to thermal shock. Special optical and acoustic characteristics. Unusually high thermal conductivity combined with good electrical insulation characteristics. Exceptional stability when exposed to many molten salts. Offer different specification and dimensions according to your request  High thermal conductivity AlN ceramic Properties Flexural strength is 300 ± 5MPa Coefficient of thermal expansion is 5.6x10-6K-1 (20-1000°C) Thermal conductivity is 100-200 Wm-1K-1 Insulation resistance is >1012Ωcm (20°C) Supply different purity products such as 95%Al2O3, 98%Al2O3, 99%Al2O3, 99.5%Al2O3 Ceramic materials.  Alumina ceramic products, including tubes, rods, crucibles, plates, and other parts by your drawing.  Silicon carbide ceramic products, including beams, plates, tubes, crucibles etc.  Boron nitride ceramic products, including plates, the crucible, and other parts as you need. Application 1. Aluminum nitride powder with high purity, small size, high activity, is the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate.  2. AlN ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high-temperature resistance, chemical corrosion resistance, high resistivity, dielectric loss is small, think of the large scale integrated circuit substrate and packaging materials.  3. More than the traditional aluminum nitride alumina, high hardness, abrasion-resistant ceramic materials is new, but because of its high cost, only for the serious wear of the parts.  4. High melt erosion and thermal shock resistance of AIN ceramics by heat, can be made of GaAs crystal crucible, Al evaporation dish, magnetic fluid generating device and the high-temperature corrosion of turbine components, using the optical properties for the infrared window. Aluminum nitride thin film can be made of the high-frequency piezoelectric element, ultra large scale integrated circuit substrate.  5.Aluminum nitride, heat resistance, erosion resistance of the molten metal, but the acid stability in alkaline solution Easy to be eroded.AIN new surface is exposed to moist air will react very thin oxide film. Using this characteristic can be used like aluminum, copper, silver, lead and other chemical properties of metal crucible for metal melting and casting mould of.AIN ceramics is better, can replace toxic beryllium oxide ceramics are widely used in the electric industry.

Supplier: Thick stoneware honey comb ceramic, thick cordier heat storing honeycomb carrier, thick cordier heat storing honeycomb carrier, cordier heat storing honeycomb carrie, thin cordier heat storing honeycomb carrier, tail gas catalyst carrier, electrial blow cordier heat storing catalyst carrier, cordier heat storing catalyst carrier, corundum heat storing catalyst carrier, aluminium oxide heat storing catalyst carrier

Supplier: Floor & wall ceramics tile, zinc oxide & talc powder
Buyer: Ceramic materials

BeO ceramic materials.BeO has high thermal conductivity, high melting point (2530 ± 10°C), high strength, high insulation, high chemical and thermal stability, low dielectric constant, low dielectric loss and good adaptability properties,etc.Widely used in special metallurgy,vacuum electronics,nuclear technology,microelectronics and optoelectronics. Especially in high-power semiconductor devices,integrated circuits, package microwave vacuum devices and nuclear reactors. Beryllium oxide (BeO), also known as beryllia, is an amorphous solid. Its high melting point leads to its use as a refractory material. Sintered beryllium oxide is a very stable ceramic. BeO-ceramic has a high range of thermal conductivity between 300 500 W/(m.k), the highest among all ceramic materials used in electronic technology. It is used in many high-performance semiconductor parts for applications such as radio equipment ,a filler in some thermal interface materials such as thermal grease, a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers,etc... Features 1. High thermal conductivity 2. High melting point 3. Excellent insulation 4. Low dielectric constant 5. Coating Layer: Molybdenum-Manganese(Mo/Mn) T: 8~30m Plated Layer: Nickel(Ni), Copper(Cu), Gold(Au), Etc. T: 2~9m 6. Excellent thermal shock resistance

Ceramic sputtering target Ceramic Sputtering Targets : Boride Sputtering Targets Cr2B,CrB,CrB2,Cr5B3, FeB,HfB2,LaB6,Mo2B,Mo2B5,NbB,NbB2,TaB,TaB2,TiB2,W2B,WB,VB,VB2,ZrB2 Carbide Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC,TiC,WC,W2C,VC,ZrC Fluoride Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3 Nitrides Sputtering Targets : AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Oxide Sputtering targets : Al2O3,Sb2O3,ATO,BaTiO3,Bi2O3,CeO2,CuO,Cr2O3 ,Dy2O3,Er2O3,Eu2O3,Gd2O3,Ga2O3,GeO2,HfO2 ,Ho2O3,In2O3,ITO,Fe2O3,Fe3O4,La2O3,PbTiO3,PbZrO3,LiNbO3,Lu3Fe5O12,Lu2O3,MgO,MoO3,Nd2O3,Pr6O11,Pr(TiO2)2,Pr2O3,Sm2O3,Sc2O3,SiO2,SiO,SrTiO3,SrZrO3,Ta2O5,Tb4O7,TeO2,ThO2,Tm2O3,TiO2,TiO,Ti3O5,Ti2O3,SnO2,SnO,WO3,V2O5,YAG, Y3Al5O12,Yb2O3,Y2O3,ZnO,ZnO:Al,ZrO2(unstabilized),ZrO2-5-15wt%CaO) Selenides Sputtering Targets : Bi2Se3,CdSe,In2Se3,PbSe,MoSe2,NbSe2,TaSe2,WSe2,ZnSe Silicides Sputtering Targets : Cr3Si,CrSi2,CoSi2, HfSi2,MoSi2,NbSi2,TaSi2,Ta5Si3,TiSi2,Ti5Si3,WSi2,V3Si,VSi2,ZrSi2 Sulfides Sputtering Targets : Sb2S3 ,As2S3,CdS,FeS,PbS,MoS2,NbS1.75,TaS2,WS2,ZnS, Tellurides Sputtering Targets : CdTe,PbTe,MoTe2,NbTe2,TaTe2,WTe2,ZnTe Other : Cr-SiO ,GaAs , Ga-P, In-Sb , InAs, InP, InSn, other target show as below: superconducting thin film, protective film. Metal Sputtering Targets (include Rare Earth metal Sputtering Target): Al,Sb,Bi ,B ,Cd ,C,Ce ,Cr ,Co ,Cu ,Dy,Er,Eu,Gd,Ge ,Au ,C,Hf,Ho,In ,Ir ,Fe ,La,Lu ,Mg,Mn,Mo ,Nd,Ni,Nb,Pd,Pt ,Pr,Re ,Ru ,Sm,Se ,Sc,Ag,Si ,Ta,Tb,Tm,Sn,Ti,W,V ,Yb,Y,Zr,Zn,La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu , Sc, Y Alloy Sputtering Targets: AlCu,AlCr,AlMg,AlSi,AlSiCu, AlAg,AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd,CeSm,CrSi,CoCr, CoCrMo, CoFe,CoFeB,CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, CrB, CrSi, CrCu, CuCo ,CuGa,CuIn,CuNi,CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC,FeMn,GdFe, GdFeCo, HfFe,IrMn,IrRe,InSn,MoSi,NiAl,NiCr,NiCrSi,NdDyFeCo, NiFe,NiMn, NiNbTi ,NiTi,NiV,SmCo, AgCu,AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl,TiNi,TiCr,WRe ,WTi,WCu, ZrAl,ZrCu, ZrFe ,ZrNb,ZrNi,ZrTi,ZrY ,ZnAl,ZnMg Purity: 99%, 99.9%,99.95% 99.99%,99.995% 99.999% and 99.9999%. Shape: foil, sheet, rod, pipe, tube, ring, wafer, plate, tablet and base on your drawing. disk, rectangle, band, rod and other shapes Dimension: Diameter (

Supplier: Iron oxide pigments, ceramic pigments
Services: Manufacturer and exporter

Ceramic kiln is an equipment to do burning to the ceramic biscuit. By having the burning, the biscuit complete the oxidization or reductio process and becomes pottery or porcelain. The craftsmen in the filed often say that ceramic kiln is the key equipment and burning process is the key process in ceramic making.